ADA4817-1ACPZ-R2 Analog Devices Inc, ADA4817-1ACPZ-R2 Datasheet - Page 2
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ADA4817-1ACPZ-R2
Manufacturer Part Number
ADA4817-1ACPZ-R2
Description
IC OPAMP VF 410MHZ LN 8LFCSP
Manufacturer
Analog Devices Inc
Series
FastFET™r
Specifications of ADA4817-1ACPZ-R2
Slew Rate
870 V/µs
Amplifier Type
Voltage Feedback
Number Of Circuits
1
Gain Bandwidth Product
410MHz
-3db Bandwidth
1.05GHz
Current - Input Bias
2pA
Voltage - Input Offset
400µV
Current - Supply
19mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
5 V ~ 10 V, ±2.5 V ~ 5 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-LFCSP
Op Amp Type
Low Noise
No. Of Amplifiers
1
Bandwidth
1.05GHz
Supply Voltage Range
5V To 10V
Amplifier Case Style
LFCSP
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
ADA4817-1/ADA4817-2
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Connection Diagrams ...................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 8
Test Circuits ..................................................................................... 13
Theory of Operation ...................................................................... 14
REVISION HISTORY
3/09—Rev. 0 to Rev. A
Added 8-Lead SOIC Package ............................................ Universal
Changes to Features Section and General Description Section . 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Changes to Figure 4 .......................................................................... 5
Changes to Figure 9, Figure 11, and Figure 12 ............................. 8
Changes to Figure 21, Figure 22, and Figure 24 ......................... 10
Changes to Figure 33 ...................................................................... 12
Added Figure 34; Renumbered Sequentially .............................. 12
Changes to Thermal Considerations Section and Power-Down
Operation Section ........................................................................... 15
Changes to Capacitive Feedback Section and Figure 46 ........... 16
Added Higher Frequency Attenuation Section, Figure 47,
Figure 48, and Figure 49; Renumbered Sequentially ................. 16
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 25
11/08—Revision 0: Initial Version
±5 V Operation ............................................................................. 3
5 V Operation ............................................................................... 4
Thermal Resistance ...................................................................... 5
Maximum Safe Power Dissipation ............................................. 5
ESD Caution .................................................................................. 5
Closed-Loop Frequency Response ........................................... 14
Noninverting Closed-Loop Frequency Response .................. 14
Inverting Closed-Loop Frequency Response ............................. 14
Wideband Operation ................................................................. 15
Rev. A | Page 2 of 28
Layout, Grounding, and Bypassing Considerations .................. 17
Applications Information .............................................................. 19
Outline Dimensions ....................................................................... 24
Driving Capacitive Loads .......................................................... 15
Thermal Considerations ............................................................ 15
Power-Down Operation ............................................................ 15
Capacitive Feedback ................................................................... 16
Higher Frequency Attenuation ................................................. 16
Signal Routing ............................................................................. 17
Power Supply Bypassing ............................................................ 17
Grounding ................................................................................... 17
Exposed Paddle ........................................................................... 17
Leakage Currents ........................................................................ 18
Input Capacitance ...................................................................... 18
Input-to-Input/Output Coupling ............................................. 18
Low Distortion Pinout ............................................................... 19
Wideband Photodiode Preamp ................................................ 19
High Speed JFET Input Instrumentation Amplifier.............. 21
Active Low-Pass Filter (LPF) .................................................... 22
Ordering Guide .......................................................................... 25