AD8044ARZ-14 Analog Devices Inc, AD8044ARZ-14 Datasheet - Page 5

IC OPAMP VF R-R QUAD LP 14SOIC

AD8044ARZ-14

Manufacturer Part Number
AD8044ARZ-14
Description
IC OPAMP VF R-R QUAD LP 14SOIC
Manufacturer
Analog Devices Inc
Datasheets

Specifications of AD8044ARZ-14

Slew Rate
190 V/µs
Amplifier Type
Voltage Feedback
Number Of Circuits
4
Output Type
Rail-to-Rail
-3db Bandwidth
160MHz
Current - Input Bias
2µA
Voltage - Input Offset
1400µV
Current - Supply
11.5mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 12 V, ±1.5 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Op Amp Type
Voltage Feedback
No. Of Amplifiers
4
Bandwidth
160MHz
Supply Voltage Range
3V To 12V
Amplifier Case Style
SOIC
No. Of Pins
14
Common Mode Rejection Ratio
90
Current, Input Bias
2 μA
Current, Input Offset
0.2 μA
Current, Output
30 mA
Harmonic Distortion
-68 dB
Impedance, Thermal
120 °C/W
Number Of Amplifiers
Quad
Package Type
SOIC-14
Power Dissipation
1 W
Resistance, Input
225 Kilohms
Temperature, Operating, Range
-40 to +85 °C
Voltage, Input
-0.2 to +4 V (Common-Mode)
Voltage, Noise
16 nV/sqrt Hz
Voltage, Offset
1 mV
Voltage, Output, High
4.975 V
Voltage, Output, Low
0.03 V
Voltage, Supply
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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REV. B
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +12.6 V
Internal Power Dissipation
Input Voltage (Common-Mode) . . . . . . . . . . . . . . ± V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 3.4 V
Output Short Circuit Duration
Storage Temperature Range (N, R) . . . . . . . –65∞C to +125∞C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300∞C
NOTES
1
2
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8044 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic encap-
sulated devices is determined by the glass transition temperature
of the plastic, approximately +150∞C. Exceeding this limit
temporarily may cause a shift in parametric performance due to
a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175∞C for an extended
period can result in device failure.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8016 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for the device in free air:
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
14-Lead Plastic Package: q
14-Lead SOIC Package: q
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . 1.6 Watts
Small Outline Package (R) . . . . . . . . . . . . . . . . . . 1.0 Watts
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Model
AD8044AN
AD8044AR-14
AD8044AR-14-REEL
AD8044AR-14-REEL7
AD8044ARZ-14*
AD8044ARZ-14-REEL*
AD8044ARZ-14-REEL7*
*Z = Pb free part
JA
JA
= 120∞C/W
= 75∞C/W
2
1
Temperature
Range
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
S
ORDERING GUIDE
± 0.5 V
–5–
While the AD8044 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature (+150∞C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
Figure 3. Maximum Power Dissipation vs. Temperature
Package
Description
14-Lead PDIP
14-Lead SOIC
14-Lead SOIC 13" REEL R-14
14-Lead SOIC 7" REEL
14-Lead Plastic SOIC
14-Lead SOIC 13" REEL R-14
14-Lead SOIC 7" REEL
2.5
2.0
1.5
1.0
0.5
–50
–40 –30 –20 –10 0
14-LEAD SOIC
AMBIENT TEMPERATURE ( C)
10 20
14-LEAD PLASTIC DIP PACKAGE
Package
Option
N-14
R-14
R-14
R-14
R-14
WARNING!
30 40 50
ESD SENSITIVE DEVICE
T
60
AD8044
J
= +150 C
70
80
90

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