SMP04EQ Analog Devices Inc, SMP04EQ Datasheet - Page 3

• Manufacturer Part Number: SMP04EQ
• Description: IC AMP SAMPLE HOLD CMOS 16CDIP
• Manufacturer: Analog Devices Inc

Specifications of SMP04EQ

• Rohs Status: RoHS non-compliant
• Amplifier Type: Sample and Hold
• Number Of Circuits: 4
• Slew Rate: 4 V/µs
• Current - Input Bias: 500nA
• Voltage - Input Offset: 2500µV
• Current - Supply: 4mA
• Current - Output / Channel: 1.2mA
• Voltage - Supply, Single/dual (±): 5 V ~ 12 V, ±2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-CDIP (0.300", 7.62mm)
• Power Supply Requirement: Single/Dual
• Mounting: Through Hole
• Output Type: -
• -3db Bandwidth: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
V
V
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .
Digital Input Voltage to DGND . . . . . . . –0.3 V, V
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature . . . . . . . . . . . . . . . . . . –65 C to +150 C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 C
REV. D
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP04 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DD
DD
LOGIC
IN
OUT
A
(Not Short-Circuit Protected)
EQ, EP, ES . . . . . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
= +25 C unless otherwise noted)
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
to V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.7 V, 17 V
V
V
DGND
OUT2
OUT1
S/H
S/H
V
V
PIN CONNECTIONS
NC
16-Lead Plastic DIP
IN1
IN2
1
2
16-Lead Cerdip
1
2
3
4
5
6
7
8
NC = NO CONNECT
16-Lead SO
(Not to Scale)
TOP VIEW
SMP04
16
15
14
13
12
11
10
9
V
V
V
V
V
V
S/H
S/H
DD
OUT3
OUT4
SS
IN4
IN3
4
3
DD
+ 0.3 V
SS
SS
20 mA
, V
, V
DD
DD
DD
–3–
Model
SMP04EQ
SMP04EP
SMP04ES
*Q = Cerdip; N = Plastic DIP; R = Small Outline.
Package Type
16-Lead Cerdip
16-Lead Plastic DIP
16-Lead SO
*
CAUTION
1. Stresses above those listed under Absolute Maximum Ratings may cause
2. Digital inputs and outputs are protected; however, permanent damage may
3. Remove power before inserting or removing units from their sockets.
in socket for cerdip and plastic DIP packages;
to printed circuit board for SO package.
JA
permanent damage to the device. This is a stress rating only; function operation
at or above this specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device reliability.
occur on unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper antistatic
handling procedures.
is specified for worst case mounting conditions, i.e.,
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
ORDERING GUIDE
94
76
92
JA
*
WARNING!
Package
Description
Cerdip-16
PDIP-16
SO-16
JA
is specified for device soldered
12
33
27
ESD SENSITIVE DEVICE
JC
JA
is specified for device
SMP04
Package
Options*
Q-16
N-16
R-16A
Units
C/W
C/W
C/W