LMC6032IMX National Semiconductor, LMC6032IMX Datasheet - Page 9

• Manufacturer Part Number: LMC6032IMX
• Description: IC OP AMP DUAL CMOS 8-SOIC
• Manufacturer: National Semiconductor

Specifications of LMC6032IMX

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 1.1 V/µs
• Gain Bandwidth Product: 1.4MHz
• Current - Input Bias: 0.04pA
• Voltage - Input Offset: 1000µV
• Current - Supply: 750µA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 4.75 V ~ 15.5 V, ±2.38 V ~ 7.75 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• -3db Bandwidth: -
• Other names: *LMC6032IMX

Application Hints
(Continued)
tive load responses. The value of the pull up resistor must be
determined based on the current sinking capability of the
amplifier with respect to the desired output swing. Open loop
gain of the amplifier can also be affected by the pull up
resistor (see Electrical Characteristics).
01113522
FIGURE 4. Compensating for Large Capacitive
Loads with a Pull Up Resistor
01113506
FIGURE 5. Example of Guard Ring in
PRINTED-CIRCUIT-BOARD LAYOUT
P.C. Board Layout
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LMC6032, typically less
than 0.04 pA, it is essential to have an excellent layout.
Fortunately, the techniques for obtaining low leakages are
quite simple. First, the user must not ignore the surface
leakage of the PC board, even though it may sometimes
appear acceptably low, because under conditions of high
humidity or dust or contamination, the surface leakage will
be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6032’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs. See Figure
5. To have a significant effect, guard rings should be placed
on both the top and bottom of the PC board. This PC foil
must then be connected to a voltage which is at the same
voltage as the amplifier inputs, since no leakage current can
flow between two points at the same potential. For example,
Ω, which is nor-
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a PC board trace-to-pad resistance of 10
mally considered a very large resistance, could leak 5 pA if
the trace were a 5V bus adjacent to the pad of an input. This
would cause a 100 times degradation from the LMC6032’s
actual performance. However, if a guard ring is held within
Ω would
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5 mV of the inputs, then even a resistance of 10
cause only 0.05 pA of leakage current, or perhaps a minor
(2:1) degradation of the amplifier’s performance. See Figure
6a, Figure 6b, Figure 6c for typical connections of guard
rings for standard op-amp configurations. If both inputs are
active and at high impedance, the guard can be tied to
ground and still provide some protection; see Figure 6d.
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