HA3-5002-5 Intersil, HA3-5002-5 Datasheet - Page 13

• Manufacturer Part Number: HA3-5002-5
• Description: IC BUFFER 110MHZ HIGH OUT 8-DIP
• Manufacturer: Intersil

Specifications of HA3-5002-5

• Amplifier Type: Buffer
• Number Of Circuits: 1
• Slew Rate: 1300 V/µs
• -3db Bandwidth: 110MHz
• Current - Input Bias: 2µA
• Voltage - Input Offset: 5000µV
• Current - Supply: 8.3mA
• Current - Output / Channel: 220mA
• Voltage - Supply, Single/dual (±): 10 V ~ 40 V, ±5 V ~ 20 V
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -

Plastic Leaded Chip Carrier Packages (PLCC)
0.020 (0.51) MAX
3 PLCS
NOTES:
0.042 (1.07)
0.048 (1.22)
1. Controlling dimension: INCH. Converted millimeter dimensions are
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
not necessarily exact.
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
PIN (1) IDENTIFIER
0.045 (1.14)
MIN
C L
D1
D
0.026 (0.66)
0.032 (0.81)
0.050 (1.27) TP
VIEW “A” TYP.
13
0.042 (1.07)
0.056 (1.42)
E1
-C-
E
C L
0.025 (0.64)
MIN
0.013 (0.33)
0.021 (0.53)
contact point.
A
A1
-C-
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.020 (0.51)
MIN
HA-5002
R
C
N20.35
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
D1
D2
A1
E1
E2
D
N
A
E
(JEDEC MS-018AA ISSUE A)
0.165
0.090
0.385
0.350
0.141
0.385
0.350
0.141
MIN
INCHES
20
MAX
0.180
0.120
0.395
0.356
0.169
0.395
0.356
0.169
MILLIMETERS
4.20
2.29
9.78
8.89
3.59
9.78
8.89
3.59
MIN
20
10.03
10.03
MAX
4.57
3.04
9.04
4.29
9.04
4.29
Rev. 2 11/97
March 8, 2006
NOTES
FN2921.11
4, 5
4, 5
3
3
6
-
-
-
-