OP07EP Analog Devices Inc, OP07EP Datasheet - Page 6

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OP07EP

Manufacturer Part Number
OP07EP
Description
IC OPAMP GP LDRIFT LN 8DIP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of OP07EP

Slew Rate
0.3 V/µs
Amplifier Type
General Purpose
Mounting Type
Through Hole
Rohs Status
RoHS non-compliant
Number Of Circuits
1
Current - Input Bias
1.2nA
Voltage - Input Offset
30µV
Voltage - Supply, Single/dual (±)
±3 V ~ 18 V
Operating Temperature
0°C ~ 70°C
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Amplifiers
1
Bandwidth
600kHz
No. Of Pins
8
Operating Temperature Range
-40°C To +85°C
Current - Supply
-
Output Type
-
Current - Output / Channel
-
-3db Bandwidth
-
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
OP07EPADI

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OP07
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage (V
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Lead Temperature, Soldering (60 sec)
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
For supply voltages less than ±22 V, the absolute maximum input voltage is
equal to the supply voltage.
S and P Packages
OP07E
OP07C
1
S
)
Ratings
±22 V
±22 V
±30 V
Indefinite
−65°C to +125°C
0°C to 70°C
−40°C to +85°C
150°C
300°C
Rev. F | Page 6 of 16
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead PDIP (P-Suffix)
8-Lead SOIC_N (S-Suffix)
JA
is specified for the worst-case conditions, that is, a device
θ
103
158
JA
θ
43
43
JC
Unit
°C/W
°C/W

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