LM6221N National Semiconductor, LM6221N Datasheet - Page 4

• Manufacturer Part Number: LM6221N
• Description: IC BUFFER HIGH SPEED 8DIP
• Manufacturer: National Semiconductor
• Series: VIP™r

Specifications of LM6221N

• Amplifier Type: Buffer
• Number Of Circuits: 1
• Slew Rate: 1200 V/µs
• -3db Bandwidth: 50MHz
• Current - Input Bias: 1µA
• Voltage - Input Offset: 15000µV
• Current - Supply: 15mA
• Current - Output / Channel: 300mA
• Voltage - Supply, Single/dual (±): 4.75 V ~ 32 V, ±2.38 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -
• Other names: *LM6221N; LM6221

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SR
SR
SR
BW
t
t
O
r
pd
Symbol
, t
AC Electrical Characteristics
The following specifications apply for Supply Voltage =
Boldface limits apply for T
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions.
Note 2: During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to output differential voltages
in excess of 8V the input current should be limited to
Note 3: The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions.
Note 4: The thermal resistance θ
1, 4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistance θ
resistance θ
are connected to 1 square inch of 2 oz. copper.
Note 5: Limits are guaranteed by testing or correlation.
Note 6: The input is biased to 2.5V and V
is reduced to 1.5 V
Note 7: Slew rate is measured with a
will be approximately
minimize device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to
measurements at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs.
Note 8: The test circuit consists of the human body model of 120 pF in series with 1500Ω.
Note 9: For specification limits over the full Military Temperature Range, see RETS6121X.
Note 10: The maximum power dissipation is a function of T
(T
S
1
2
3
f
J(max)
–T
A
)/θ
JA
Slew Rate 1
Slew Rate 2
Slew Rate 3
−3 dB Bandwidth
Rise Time
Fall Time
Propagation
Delay Time
Overshoot
JA
of the device in the M package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14)
.
PP
Parameter
.
±
10V. Slew rate is calculated for transitions between
JA
A
= T
of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins
±
11V input pulse and 50Ω source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50Ω load, the output swing
J
V
V
(Note 7)
V
V
V
C
R
V
R
V
R
V
IN
= T
IN
IN
IN
+
IN
L
L
O
L
O
L
O
swings V
= 5V (Note 6)
≤ 10 pF
= 50Ω, C
= 50Ω, C
= 50Ω, C
= 100 mV
= 100 mV
= 100 mV
MIN
=
=
= 2 V
=
±
±
±
11V, R
11V, R
100 mV
to T
±
PP
PP
Conditions
20 mA.
about this value. The input swing is 2 V
MAX
, R
L
L
L
PP
PP
PP
≤ 10 pF
≤ 10 pF
≤ 10 pF
J(max)
L
L
L
PP
; all other limits T
= 1 kΩ
= 50Ω
= 50Ω
, R
, θ
L
JA
±
= 50Ω
, and T
15V, V
±
5V levels on both rising and falling edges. A high speed measurement is done to
A
. The maximum allowable power dissipation at any ambient temperature is P
4
CM
A
= 0, R
= T
1200
Typ
800
7.0
4.0
50
50
10
J
= 25˚C.
L
≥ 100 kΩ and R
PP
at all temperatures except for the A
LM6121
(Note 5)
Limit
550
550
550
30
S
JA
= 50Ω unless otherwise noted.
LM6221
(Note 5)
of the N package is 84˚C/W. The thermal
Limit
550
550
550
30
V
3 test at −55˚C where it
LM6321
(Note 5)
Limit
550
550
550
30
±
10V for
Units
MHz
V/µs
Min
Min
ns
ns
D
%
=