MC33202DR2G ON Semiconductor, MC33202DR2G Datasheet - Page 15

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MC33202DR2G

Manufacturer Part Number
MC33202DR2G
Description
IC OPAMP DUAL R-R LOW VOLT 8SOIC
Manufacturer
ON Semiconductor
Type
General Purpose Amplifierr
Datasheet

Specifications of MC33202DR2G

Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
1 V/µs
Gain Bandwidth Product
2.2MHz
Current - Input Bias
80nA
Voltage - Input Offset
8000µV
Current - Supply
1.125mA
Current - Output / Channel
80mA
Voltage - Supply, Single/dual (±)
1.8 V ~ 12 V, ±0.9 V ~ 6 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Number Of Channels
2
Common Mode Rejection Ratio (min)
60 dB
Input Voltage Range (max)
Positive Rail
Input Voltage Range (min)
Negative Rail
Input Offset Voltage
8 mV
Input Bias Current (max)
200 nA
Operating Supply Voltage
12 V
Supply Current
1.8 mA
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Dual Supply Voltage
+/- 3 V, +/- 5 V
Maximum Dual Supply Voltage
+/- 6 V
Minimum Dual Supply Voltage
+/- 0.9 V
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
12 V
Supply Voltage (min)
1.8 V
Technology
Bipolar
Voltage Gain Db
109.54 dB
Rail/rail I/o Type
Rail to Rail Input/Output
Number Of Elements
2
Unity Gain Bandwidth Product
2.2MHz
Common Mode Rejection Ratio
60dB
Input Bias Current
200nA
Single Supply Voltage (typ)
3/5/9V
Dual Supply Voltage (typ)
±3/±5V
Voltage Gain In Db
109.54dB
Power Supply Rejection Ratio
66.02dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
1.8V
Single Supply Voltage (max)
12V
Dual Supply Voltage (min)
±0.9V
Dual Supply Voltage (max)
±6V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33202DR2GOS
MC33202DR2GOS
MC33202DR2GOSTR

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−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
H
E
e
D D
A1
A
b
*For additional information on our Pb−Free strategy and soldering
E
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
8 PL
0.08 (0.003)
8X
0.041
1.04
c
6X
0.0256
0.126
0.65
3.20
M
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
T
B
http://onsemi.com
CASE 846A−02
S
DM SUFFIX
A
ISSUE H
Micro8
L
S
0.015
15
0.38
8X
0.167
4.24
SCALE 8:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
0.208
5.28
DIM
H
A1
A
b
c
D
E
e
L
E
inches
MIN
0.05
0.25
0.13
2.90
2.90
0.40
4.75
mm
−−
MILLIMETERS
0.65 BSC
NOM
0.08
0.33
0.18
3.00
3.00
0.55
4.90
−−
MAX
1.10
0.15
0.40
0.23
3.10
3.10
0.70
5.05
0.002
0.010
0.005
0.016
0.187
0.114
0.114
MIN
−−
0.026 BSC
INCHES
0.003
0.013
0.007
0.118
0.118
0.021
0.193
NOM
−−
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
MAX

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