NE5534DG ON Semiconductor, NE5534DG Datasheet
NE5534DG
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NE5534DG Summary of contents
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NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A Single Low Noise Operational Amplifier The NE/SA/SE5534/5534A are single high-performance low noise operational amplifiers. Compared to other operational amplifiers, such as TL083, they show better noise performance, improved output drive capability, and considerably higher ...
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MAXIMUM RATINGS Rating Supply Voltage Input Voltage Differential Input Voltage (Note 1) Operating Temperature Range Storage Temperature Range Junction Temperature Power Dissipation at 25°C Thermal Resistance, Junction−to−Ambient Output Short-Circuit Duration (Note 2) Lead Soldering ...
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DC ELECTRICAL CHARACTERISTICS Characteristic Symbol V OS Offset Voltage DV / Offset Current DI / Input Current / Supply Current I CC Per Op Amp Common Mode Input Range V CM Common ...
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AC ELECTRICAL CHARACTERISTICS Characteristic Symbol Output Resistance R OUT Transient Response Rise Time t R Overshoot − Transient Response Rise Time t R Overshoot − Gain A V Gain Bandwidth Product GBW Slew Rate SR Power Bandwidth − ELECTRICAL CHARACTERISTICS ...
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TYPICAL PERFORMANCE CHARACTERISTICS 120 TYPICAL VALUES 22pF - (Hz) Figure 2. Open-Loop Frequency Response ...
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TYPICAL PERFORMANCE CHARACTERISTICS In(rms TYP −1 10 − (Hz) Figure 11. Input Noise Current Density 6 10 TYPICAL VALUES 10Hz 3 ...
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5534 + Figure 14. Frequency Compensation and Offset Voltage Adjustment Circuit CAL POWER OSC SUPPLY + DUT 1W - 10kW 100W TEST ...
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... Plastic Dual In−Line Package (PDIP−8) NE5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) NE5534D 8−Pin Plastic Small Outline (SO−8) Package NE5534DG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) NE5534DR2 8−Pin Plastic Small Outline (SO−8) Package NE5534DR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) NE5534N 8− ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS) ...