SE5230DR2G ON Semiconductor, SE5230DR2G Datasheet - Page 2

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SE5230DR2G

Manufacturer Part Number
SE5230DR2G
Description
IC OP AMP LOW VOLTAGE 8-SOIC
Manufacturer
ON Semiconductor
Type
General Purpose Amplifierr
Datasheet

Specifications of SE5230DR2G

Amplifier Type
General Purpose
Number Of Circuits
1
Output Type
Rail-to-Rail
Slew Rate
0.25 V/µs
Gain Bandwidth Product
600kHz
Current - Input Bias
40nA
Voltage - Input Offset
400µV
Current - Supply
1.1mA
Current - Output / Channel
32mA
Voltage - Supply, Single/dual (±)
1.8 V ~ 15 V, ±0.9 V ~ 7.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Number Of Channels
1
Voltage Gain Db
126.02 dB
Common Mode Rejection Ratio (min)
85 dB
Input Offset Voltage
3 mV
Operating Supply Voltage
3 V, 5 V, 9 V, 12 V
Supply Current
1.6 mA
Maximum Power Dissipation
500 mW
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Maximum Dual Supply Voltage
+/- 7.5 V
Minimum Operating Temperature
- 40 C
Rail/rail I/o Type
No
Number Of Elements
1
Unity Gain Bandwidth Product
0.6MHz
Common Mode Rejection Ratio
85dB
Input Bias Current
150nA
Single Supply Voltage (typ)
3/5/9/12V
Dual Supply Voltage (typ)
±3/±5V
Power Dissipation
500mW
Voltage Gain In Db
126.02dB
Power Supply Rejection Ratio
85dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
1.8V
Single Supply Voltage (max)
15V
Dual Supply Voltage (min)
±0.9V
Dual Supply Voltage (max)
±7.5V
Technology
Bipolar
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SE5230DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Can exceed the supply voltages when V
2. The maximum operating junction temperature is 150°C. At elevated temperatures, devices must be derated according to the package thermal
3. Momentary shorts to either supply are permitted in accordance to transient thermal impedance limitations determined by the package and
MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
Single Supply Voltage
Dual Supply Voltage
Input Voltage (Note 1)
Differential Input Voltage (Note 1)
Common−Mode Voltage (Positive)
Common−Mode Voltage (Negative)
Power Dissipation (Note 2)
Thermal Resistance, Junction−to−Ambient
Operating Junction Temperature (Note 2)
Operating Temperature Range
80 Output Short−Circuit Duration to Either Power Supply Pin (Notes 2 and 3)
Storage Temperature
Lead Soldering Temperature (10 sec max)
Single Supply Voltage
Dual Supply Voltage
Common−Mode Voltage (Positive)
Common−Mode Voltage (Negative)
Temperature
resistance and device mounting conditions.
Derate above 25°C at the following rates:
device mounting conditions.
N package at 7.7 mW/°C
D package at 5.5 mW/°C.
Rating
Characteristic
S
≤ ±7.5 V (15 V).
http://onsemi.com
2
N Package
D Package
NE
NE Grade
SA Grade
SE Grade
SA
SE
Symbol
R
V
V
V
T
T
V
P
V
T
T
qJA
CC
CM
CM
stg
sld
IN
D
A
S
J
±0.9 to ±7.5
−40 to +125
V
V
−40 to +85
1.8 to 15
0 to +70
CC
EE
Value
−40 to 125
−65 to 150
V
V
−40 to 85
Indefinite
+ 0.25
− 0.25
±9 (18)
CC
0 to 70
EE
Value
±V
500
130
182
150
230
18
±9
− 0.5
+ 0.5
S
°C/W
Unit
Unit
mW
°C
°C
°C
°C
°C
V
V
V
V
V
V
s
V
V
V
V

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