MAX809TTRG ON Semiconductor, MAX809TTRG Datasheet - Page 12

• Manufacturer Part Number: MAX809TTRG
• Description: IC MPU SUPERVISORY 3.08V SOT23
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MAX809TTRG

• Number Of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 3.08V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Number Of Elements: 1
• Monitored Voltage 1 (typ): 1.2 to 4.9V
• Threshold Voltage 1 (max): 3.11V
• Battery Backup Switching: No
• Watchdog Timer: No
• Chip Enable Signals: No
• Reset Active Time: 460ms
• Manual Reset: No
• Package Type: SOT-23
• Operating Supply Voltage (min): 1.2V
• Operating Supply Voltage (max): 5.5V
• Reset Threshold Voltage (max): 3.11V
• Reset Threshold Voltage (min): 3.04V
• Family Name: MAX809
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Power Fail Detection: No
• Mounting: Surface Mount
• Pin Count: 3
• Supply Current: 0.0025mA
• Monitored Voltage: 1.2 V to 4.9 V
• Undervoltage Threshold: 3.08 V
• Output Type: Push-Pull
• Watchdog: No Watchdog
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 0.8 uA
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Overvoltage Threshold: 3.11 V
• Power-up Reset Delay (typ): 460 ms
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX809TTRGOSTR

A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
VIEW C
L1
http://onsemi.com
SOT−23 (TO236)
L
CASE 318−08
ISSUE AN
q
0.25
12
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
inches
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
2.0
DIM
mm
A1
H
L1
A
b
c
D
E
e
L
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.047
0.070
0.004
0.014
0.083
0.110
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX