CG2470MS Littelfuse Inc, CG2470MS Datasheet - Page 4
![SURGE ARRESTER GDT 470V SMD](/photos/1/29/12908/cg2470ms_sml.jpg)
CG2470MS
Manufacturer Part Number
CG2470MS
Description
SURGE ARRESTER GDT 470V SMD
Manufacturer
Littelfuse Inc
Series
CG2r
Specifications of CG2470MS
Spark Over Voltage
470V
Impulse Discharge Current
20kA 8x20µs
Package / Case
Non-Standard SMD
Mounting Type
Surface Mount
Impulse Discharge Current (typ)@8/20us@10times
10
Number Of Electrodes
2
Dc Sparkover Voltage (typ)@100v/s
470
Dc Holdover Voltage (max)
135@150ms
Impulse Sparkover Voltage (max)@1kv/s
1200
Impulse Sparkover Voltage (max)@100v/s
850
Failsafe Protection
No
Mounting Style
Surface Mount
Number Of Terminals
2
Product Height (mm)
8.3mm
Capacitance (max)@1mhz
1.5
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
90C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
420-1082-2
420-1082-2
CG2-470MS
420-1082-2
CG2-470MS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CG2470MS
Manufacturer:
OSRAM
Quantity:
3 150
Solder Iron Temperature: 350° C +/- 5°C
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Refer to www.littelfuse.com/series/CG/CG2.html for current information.
Customer should verify actual device performance in their specific applications.
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within °C of actual peak
Temperature (t
Ramp-down Rate
Time 2 °C to peak Temperature (T
Do not exceed
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
300
280
260
240
220
200
180
160
140
120
100
S(max)
Time (Seconds)
80
60
40
20
L
0
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (Min to Max) (t
- Temperature (T
- Temperature (t
p
)
Preheat Time
P
)
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
Dwell Time
)
)
)
Pb – Free assembly
150°C
200°C
3°C/second max
5°C/second max
217°C
10 – 30 seconds
Gas Plasma Arrester (GDT) Products
Medium to High Surge Arrestors > CG/CG2 Series
Cooling Time
+0/-5
°C
Revised: July 24, 2009
Recommended Process Parameters:
Preheat:
(Depends on Flux Activation Temperature)
Solder Pot Temperature:
Solder Dwell Time:
Preheat Time:
T
T
S(max)
S(min)
25
Wave Parameter
T
T
P
L
time to peak temperature
(t 25ºC to peak)
t
Preheat
S
(Typical Industry Recommendation)
100
150
2-5 seconds
Ramp-up
Lead-Free Recommendation
°
°
°
C
C
t
t
P
L
Time
Ramp-down
Critical Zone
CG/CG2 Series
T
L
to T
P