B57237S0229M000 EPCOS Inc, B57237S0229M000 Datasheet - Page 10
![CURRENT LIMITR INRSH 2.2 OHM 20%](/photos/1/29/12971/b57237_series_sml.jpg)
B57237S0229M000
Manufacturer Part Number
B57237S0229M000
Description
CURRENT LIMITR INRSH 2.2 OHM 20%
Manufacturer
EPCOS Inc
Datasheet
1.B57237S0220M000.pdf
(15 pages)
Specifications of B57237S0229M000
R @ 25°c
2.2 Ohm
Current - Steady State Max
7A
Tolerance
±20%
Diameter
0.59" (15mm)
Lead Spacing
0.295" (7.50mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
R @ Current
-
Other names
495-3055
B57237S 229M
B57237S229M
B57237S229M
B57237S 229M
B57237S229M
B57237S229M
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B57237S0229M000
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180 of a lead bent by 90 is permissible at 6 mm from the bottom of the
thermistor body.
3
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
4
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
5
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
Max. relative humidity (without condensation):
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
Leaded components:
Please read Cautions and warnings and
Important notes at the end of this document.
Inrush current limiters
ICLs
Sealing and potting
Cleaning
Storage
Page 10 of 15
<95%, maximum 30 days per annum
24 months
25 C up to 45 C
B57237
S237