MF-USMF010-2 Bourns Inc., MF-USMF010-2 Datasheet - Page 2

• Manufacturer Part Number: MF-USMF010-2
• Description: FUSE RESETTABLE .10A 30V HLD SMD
• Manufacturer: Bourns Inc.
• Series: MF-USMFr
• Type: PTC Resettable Fusesr

Specifications of MF-USMF010-2

• Package / Case: 1210 (3225 Metric)
• R Min/max: 0.800 ~ 15.00 Ohm
• Voltage - Max: 30V
• Time To Trip: 0.6s
• Current - Hold (ih) (max): 100mA
• Current - Trip (it): 300mA
• Current - Max: 10A
• Hold Current: 0.1 Amp
• Trip Current: 0.3 Amp
• Current Rating (max): 10 Amps
• Resistance: 15 Ohms
• Maximum Voltage: 30 VoltsDC
• Termination Style: SMD/SMT
• Mounting Style: SMD/SMT
• Current Rating: 10 Amps
• Dimensions: 3.43 mm L x 2.8 mm W x 1.1 mm H
• Operating Temperature Range: - 40 C to + 85 C
• Brand/series: MF-USMF Series
• Current, Rating: 10 A
• Mounting Type: PCB
• Primary Type: Resettable
• Resistance, Dc: 0.8 Ohms
• Size: 1210
• Termination: SMT
• Voltage, Rating: 30 VDC
• Holding Current: 100mA
• Tripping Current: 300mA
• Initial Resistance Max: 15ohm
• Operating Voltage: 30V
• Ptc Fuse Case: 1210
• External Depth: 0.95mm
• Initial Resistance Min: 0.8ohm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: MF-USMF010-2TR

Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Packaging: 3000 pcs. per reel.
Product Dimensions
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175X
Solder Reflow Recommendations
Top and Bottom View
Model
MF-USMF Series -
D
A
300
250
200
150
100
50
0
B
Preheating
Side View
C
(0.118)
(0.118)
(0.118)
(0.118)
(0.118)
(0.118)
(0.118)
(0.118)
(0.118)
Min.
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
160–220
A
PTC Resettable Fuses
(0.135)
(0.135)
(0.135)
(0.135)
(0.135)
(0.135)
(0.135)
(0.135)
(0.135)
Max.
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
Recommended Pad Layout
(.039 ± .002)
Soldering
1.0 ± 0.05
Time (seconds)
10–20
(.079 ± .004)
2.0 ± 0.1
(0.093)
(0.093)
(0.093)
(0.093)
(0.093)
(0.093)
(0.093)
(0.093)
(0.093)
Min.
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
Cooling
120
B
(.098 ± .004)
2.5 ± 0.1
(.039 ± .002)
1.0 ± 0.05
(0.110)
(0.110)
(0.110)
(0.110)
(0.110)
(0.110)
(0.110)
(0.110)
(0.110)
Max.
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
2.80
Notes:
• MF-USMF models cannot be wave soldered.
• If reflow temperatures exceed the recommended profile,
• Compatible with Pb and Pb-free solder reflow profiles.
devices may not meet the performance requirements.
(0.031)
(0.031)
(0.031)
(0.022)
(0.022)
(0.022)
(0.022)
(0.016)
(0.016)
Min.
0.80
0.80
0.80
0.55
0.55
0.55
0.55
0.40
0.40
Terminal material:
Termination pad solderability:
Recommended Storage:
Electroless Ni under immersion Au
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
40 °C max./70 % RH max.
C
(0.043)
(0.043)
(0.043)
(0.033)
(0.033)
(0.033)
(0.033)
(0.033)
(0.033)
Max.
0.85
0.85
0.85
0.85
0.85
0.85
1.1
1.1
1.1
UNIT =
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
Min.
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
D
(INCHES)
MM