MC33164D-003 ON Semiconductor, MC33164D-003 Datasheet - Page 10
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MC33164D-003
Manufacturer Part Number
MC33164D-003
Description
IC SENSOR UNDERVOLTAGE 8SOIC
Manufacturer
ON Semiconductor
Type
Simple Reset/Power-On Resetr
Datasheet
1.MC34164D-3G.pdf
(12 pages)
Specifications of MC33164D-003
Number Of Voltages Monitored
1
Output
Open Drain or Open Collector
Reset
Active Low
Voltage - Threshold
2.68V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Reset Timeout
-
Other names
MC33164D-003OS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC33164D-003
Manufacturer:
ON Semiconductor
Quantity:
450
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
PACKAGE DIMENSIONS
1.0
C A B
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
TSOP−5
K
10
0.074
DETAIL Z
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_