MAX809LTRG ON Semiconductor, MAX809LTRG Datasheet - Page 12
![IC MPU SUPERVISORY 4.63V SOT23](/photos/1/38/13877/sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
MAX809LTRG
Manufacturer Part Number
MAX809LTRG
Description
IC MPU SUPERVISORY 4.63V SOT23
Manufacturer
ON Semiconductor
Type
Simple Reset/Power-On Resetr
Specifications of MAX809LTRG
Number Of Voltages Monitored
1
Output
Push-Pull, Totem Pole
Reset
Active Low
Reset Timeout
140 ms Minimum
Voltage - Threshold
4.63V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Current, Output
20 mA
Current, Supply
2.5 μA
Package Type
SOT-23
Temperature, Operating, Range
-40 to +105 °C
Voltage, Output, High
4.4 V
Voltage, Output, Low
0.3 V
Voltage, Supply
1.2 to 5.5 V
Monitored Voltage
1.2 V to 4.9 V
Undervoltage Threshold
4.63 V
Output Type
Push-Pull
Manual Reset
Not Resettable
Watchdog
No Watchdog
Battery Backup Switching
No Backup
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1 V
Supply Current (typ)
0.8 uA
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Power Fail Detection
No
Number Of Elements
1
Monitored Voltage 1 (typ)
1.2 to 4.9V
Threshold Voltage 1 (max)
4.7V
Watchdog Timer
No
Chip Enable Signals
No
Reset Active Time
460ms
Operating Supply Voltage (min)
1.2V
Operating Supply Voltage (max)
5.5V
Reset Threshold Voltage (max)
4.7V
Reset Threshold Voltage (min)
4.56V
Family Name
MAX809
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
3
Supply Current
0.0025mA
Overvoltage Threshold
4.7 V
Power-up Reset Delay (typ)
460 ms
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MAX809LTRGOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MAX809LTRG
Manufacturer:
ICHAUS
Quantity:
1 045
Company:
Part Number:
MAX809LTRG
Manufacturer:
ON
Quantity:
3 000
Part Number:
MAX809LTRG
Manufacturer:
ON/安森美
Quantity:
20 000
A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
VIEW C
L1
http://onsemi.com
SOT−23 (TO236)
L
CASE 318−08
ISSUE AN
q
0.25
12
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
inches
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
2.0
DIM
mm
A1
H
L1
A
b
c
D
E
e
L
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.047
0.070
0.004
0.014
0.083
0.110
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX