SC1453ISK2.5TRT Semtech, SC1453ISK2.5TRT Datasheet - Page 8

IC LDO REG 2.5V 150MA SOT-23-5

SC1453ISK2.5TRT

Manufacturer Part Number
SC1453ISK2.5TRT
Description
IC LDO REG 2.5V 150MA SOT-23-5
Manufacturer
Semtech
Datasheet

Specifications of SC1453ISK2.5TRT

Regulator Topology
Positive Fixed
Voltage - Output
2.5V
Voltage - Input
Up to 6.5V
Voltage - Dropout (typical)
0.15V @ 150mA
Number Of Regulators
1
Current - Output
150mA
Current - Limit (min)
400mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SOT-23-5, SC-74A, SOT-25
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SC1453ISK2.5TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SC1453ISK2.5TRT
Manufacturer:
SEMTECH/美国升特
Quantity:
20 000
Inserting these values into equation (2) gives us:
Using this figure, we can calculate the maximum thermal
impedance allowable to maintain T
With the standard SOT-23-5/TSOT-23-5 Land Pattern
shown at the end of this datasheet, and minimum trace
widths, the thermal impedance junction to ambient for
SC1453ISK is 256°C/W. Thus no additional heatsinking
is required for this example.
The junction temperature can be reduced further (or
higher power dissipation can be allowed) by the use of
larger trace widths and connecting PCB copper to the
GND pin (pin 2), which connects directly to the device
substrate. Adding approximately one square inch of PCB
copper to pin 2 will reduce
130°C/W and T
approximately 100°C for the SOT-23-5 package. The use
of multi layer boards with internal ground/power planes
will lower the junction temperature and improve overall
output voltage accuracy.
P
POWER MANAGEMENT
Applications Information (Cont.)
D
JA
(
2008 Semtech Corp.
MAX
(
MAX
)
)
. 3
T
465
( J
MAX
P
)
D
(
. 2
MAX
T
744
A
J(MAX)
)
(
MAX
)
. 0
for the example above to
150
125
. 0
108
108
NOT RECOMMENDED FOR NEW DESIGN
85
J
JA
mW
to approximately
125°C:
370
C
/
W
8
Layout Considerations
While layout for linear devices is generally not as critical
as for a switching application, careful attention to detail
will ensure reliable operation.
1) Attaching the part to a larger copper footprint will
enable better heat transfer from the device, especially
on PCBs where there are internal ground and power
planes.
2) Place the input, output and bypass capacitors close
to the device for optimal transient response and device
behaviour.
3) Connect all ground connections directly to the ground
plane. If there is no ground plane, connect to a common
local ground point before connecting to board ground.
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SC1453

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