LM3480IM3-3.3/NOPB National Semiconductor, LM3480IM3-3.3/NOPB Datasheet - Page 4

• Manufacturer Part Number: LM3480IM3-3.3/NOPB
• Description: IC VREG LDO 100MA 3.3V SOT23-3
• Manufacturer: National Semiconductor

Specifications of LM3480IM3-3.3/NOPB

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 30V
• Voltage - Dropout (typical): 0.9V @ 100mA
• Number Of Regulators: 1
• Current - Output: 100mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Other names: LM3480IM3-3.3; LM3480IM3-3.3TR

www.national.com
Nominal Output Voltage (V
V
∆V
∆V
I
V
V
e
GND
Symbol
n
Electrical Characteristics
OUT
IN
OUT
LM3480-12, LM3480-15
Typicals and limits appearing in normal type apply for T
junction temperature range for operation, −40 to +125˚C. (Notes 9, 10, 11)
Note 1: The package code MA03B is internal to National Semiconductor Corporation and indicates a specific version of the SOT-23 package and associated
mechanical drawings.
Note 2: The suffix “I” indicates the junction temperature range for operation is the industrial temperature range, −40 to +125˚C. The suffix “M3” indicates the die is
packaged in the 3-lead SOT-23 package. The suffix “X” indicates the devices will be supplied in blocks of 3k units as opposed to blocks of 250 units.
Note 3: Because the entire part number does not fit on the SOT-23 package, the SOT-23 package is marked with this code instead of the part number.
Note 4: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 5: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (T
temperature, T
Maximum junction temperature, 150˚C, for T
can be safely dissipated at higher ambient temperatures. The Absolute Maximum power dissipation can be increased by 3.33 mW for each ˚C below 50˚C ambient.
It must be derated by 3.33 mW for each ˚C above 50˚C ambient. A θ
package. Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction temperature to about 150˚C.
Note 6: Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline packages, refer to
the Packaging Databook available from National Semiconductor Corporation.
Note 7: For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
Note 8: As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 250 mW rating
appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for T
P = (T
dissipation for operation appearing under Operating Ratings can be increased by 3.33 mW for each ˚C below 50˚C ambient. It must be derated by 3.33 mW for each
˚C above 50˚C ambient. A θ
dissipation of more power during operation.
Note 9: A typical is the center of characterization data taken with T
Note 10: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with T
limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 11: All voltages except dropout are with respect to the voltage at the GND pin.
OUT
OUT
-
J
- T
A
)/θ
Output Voltage
Line Regulation
Load Regulation
Ground Pin
Current
Dropout Voltage
Output Noise
Voltage
JA
A
. More power can be dissipated at lower ambient temperatures. Less power can be dissipated at higher ambient temperatures. The maximum power
is the ambient temperature, and θ
Parameter
JA
of 300˚C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23 package. Heat sinking enables the
NOM
)
V
1 mA ≤ I
V
I
V
10 mA ≤ I
V
No Load
I
I
V
Bandwidth: 10 Hz to 100 kHz
OUT
OUT
OUT
IN
NOM
IN
NOM
IN
J
= V
= V
= 10V,
, 50˚C for T
= 1 mA
= 10 mA
= 100 mA
+ 1.5V ≤ V
+ 1.5V ≤ V
NOM
NOM
OUT
Conditions
OUT
JA
+ 1.5V,
+ 1.5V,
is the junction-to-ambient thermal resistance. The 333 mW rating results from substituting the Absolute
≤ 100 mA
(Continued)
A
≤ 100 mA
, and 300˚C/W for θ
IN
IN
≤ 30V,
≤ 30V,
JA
A
of 300˚C/W represents the worst-case condition of no heat sinking of the 3-lead plastic SOT-23
= T
A
J
= T
= 25˚C. Typicals are not guaranteed.
JA
J
. More power can be safely dissipated at lower ambient temperatures. Less power
= 25˚C. Limits appearing in boldface type apply over the entire
4
Typical
12.00
360
0.7
0.9
14
36
2
12V
11.52
11.40
12.48
12.60
Limit
0.9
1.0
1.1
1.2
40
60
4
Typical
15.00
450
0.7
0.9
16
45
2
J
, 50˚C for T
J
15V
- T
A
A
)/θ
= T
JA
A
Limit
14.40
14.25
15.60
15.75
J
, and 300˚C/W for θ
0.9
1.0
1.1
1.2
where T
= 25˚C. All hot and cold
40
75
4
J
is the junction
mV(max)
mV(max)
mA(max)
V(max)
V(max)
V(max)
V(max)
V(max)
V(max)
V(min)
V(min)
Units
µV
mV
mV
mA
V
V
V
rms
JA
in