LM78L12ACM/NOPB National Semiconductor, LM78L12ACM/NOPB Datasheet
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LM78L12ACM/NOPB
Specifications of LM78L12ACM/NOPB
*LM78L12ACM/NOPB
LM78L12ACM
Related parts for LM78L12ACM/NOPB
LM78L12ACM/NOPB Summary of contents
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... Top View 8-Bump micro SMD Top View (Bump Side Down) © 2006 National Semiconductor Corporation nal power dissipation. If internal power dissipation becomes too high for the heat sinking provided, the thermal shutdown circuit takes over preventing the IC from overheating. Features ...
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Ordering Information Package NSC Drawing micro SMD BPA08AAB Thin micro SMD TPA08AAA SOIC Narrow M08A TO-92 Z03A Output Voltage Order Number LM78L05IBP 5V LM78L05IBPX LM78L05ITP 5V LM78L05ITPX LM78L09ITP 9V LM78L09ITPX LM78L05ACM 5V LM78L05ACMX LM78L12ACM 12V LM78L12ACMX LM78L15ACM 15V LM78L15ACMX 5V ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Power Dissipation (Note 5) Input Voltage Storage Temperature ESD Susceptibility (Note 2) LM78LXX Electrical Characteristics applies over 0˚C to 125˚C for SO-8 and TO-92 packages, and −40˚C to 85˚C for micro SMD package. Limits are guaran- teed by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods ...
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LM78LXX Electrical Characteristics applies over 0˚C to 125˚C for SO-8 and TO-92 packages, and −40˚C to 85˚C for micro SMD package. Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise specified: ...
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LM78LXX Electrical Characteristics applies over 0˚C to 125˚C for SO-8 and TO-92 packages, and −40˚C to 85˚C for micro SMD package. Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise specified: ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) S.O. Package (M) NS Package Number M08A 13 ...
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... BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...