LM340S-5.0/NOPB National Semiconductor, LM340S-5.0/NOPB Datasheet - Page 12
![IC REGULATOR POSITIVE 5V TO-263](/photos/12/65/126593/ts3b_sml.jpg)
LM340S-5.0/NOPB
Manufacturer Part Number
LM340S-5.0/NOPB
Description
IC REGULATOR POSITIVE 5V TO-263
Manufacturer
National Semiconductor
Type
Voltage Regulatorr
Specifications of LM340S-5.0/NOPB
Regulator Topology
Positive Fixed
Voltage - Output
5V
Voltage - Input
7.5 ~ 35 V
Voltage - Dropout (typical)
2V @ 1A
Number Of Regulators
1
Current - Output
1.5A
Current - Limit (min)
2.4A
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (3 leads + Tab), TO-263AA
Current, Output
1 A
Current, Supply
6 mA
Package Type
TO-263
Regulation, Line
3 mV
Regulation, Load
10 mV
Regulator Type
Positive Voltage Out
Temperature, Operating, Range
0 to +125 °C
Voltage, Dropout
2 V
Voltage, Input
10 V
Voltage, Noise
40 μV
Voltage, Output
5 V
Voltage, Supply, Rejection Ratio
80 dB
Primary Input Voltage
20V
Output Voltage Fixed
5V
No. Of Outputs
1
No. Of Pins
3
Output Current
1A
Operating Temperature Range
0°C To +125°C
Msl
MSL 3 - 168 Hours
Filter Terminals
SMD
Rohs Compliant
Yes
Current Rating
1A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*LM340S-5.0
*LM340S-5.0/NOPB
LM340S-5.0
*LM340S-5.0/NOPB
LM340S-5.0
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM340S-5.0/NOPB
Manufacturer:
TI
Quantity:
12 400
www.national.com
Application Hints
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the plane.
shows for the TO-263 the measured values of θ
different copper area sizes using a typical PCB with 1 ounce
copper and no solder mask over the copper area used for
heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32˚C/W.
As a design aid, Figure 5 shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
mum junction temperature is 125˚C).
FIGURE 5. Maximum Power Dissipation vs
FIGURE 4. θ
T
Area for the TO-263 Package
AMB
for the TO-263 Package
(J–A)
vs Copper (1 ounce)
(J–A)
(Continued)
is 35˚C/W and the maxi-
(J–A)
00778139
for the TO-263
00778140
(J–A)
for
12
Figures 6, 7 show the information for the SOT-223 package.
Figure 6 assumes a θ
51˚C/W for 2 ounce copper and a maximum junction tem-
perature of 125˚C.
Please see AN-1028 for power enhancement techniques to
be used with the SOT-223 package.
FIGURE 6. θ
FIGURE 7. Maximum Power Dissipation vs
T
AMB
for the SOT-223 Package
for the SOT-223 Package
(J–A)
(J–A)
vs Copper (2 ounce) Area
of 74˚C/W for 1 ounce copper and
00778141
00778142