LP38511MR-ADJ/NOPB National Semiconductor, LP38511MR-ADJ/NOPB Datasheet - Page 2

• Manufacturer Part Number: LP38511MR-ADJ/NOPB
• Description: IC REG LDO 800MA ADJ 8-PSOP
• Manufacturer: National Semiconductor

Specifications of LP38511MR-ADJ/NOPB

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.5 ~ 3.3 V
• Voltage - Input: 2.25 ~ 5.5 V
• Number Of Regulators: 1
• Current - Output: 800mA (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-PSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Current - Limit (min): -
• Other names: *LP38511MR-ADJ/NOPB; LP38511MR-ADJ

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Ordering Information
Connection Diagrams
Pin Descriptions for TO-263 THIN (TJ) Package
Pin Descriptions for PSOP-8 (MR) Package
Voltage
Output
Pin #
Pin #
DAP
DAP
ADJ
1, 2
7, 8
1
2
3
4
5
3
4
5
6
Pin Name
Pin Name
TO-263 THIN Package
GND
GND
OUT
DAP
OUT
DAP
ADJ
ADJ
N/C
LP38511MRX-ADJ
EN
EN
IN
IN
LP38511MR-ADJ
LP38511TJ-ADJ
Number
Top View
Order
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
must be tied to the input voltage, or actively driven.
Input Supply Pin.
Ground
Regulated Output Voltage Pin.
The feedback to the internal Error Amplifier to set the output voltage.
The Thin TO-263 DAP is used as a thermal connection to remove heat from the device to an
external heat-sink in the form of the copper area on the printed circuit board. The DAP is physically
connected to backside of the die. The DAP is internally connected to device ground. The DAP
should be soldered to the Ground Plane copper.
Regulated Output Voltage Pins. Pins 1 and 2 share current and must be connected together.
The feedback to the internal Error Amplifier to set the output voltage.
No internal connection
Ground
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
must be tied to the input voltage, or actively driven.
Input Supply Pin. Pins 7 and 8 share current and must be connected together.
The PSOP-8 DAP is used as a thermal connection to remove heat from the device to an external
heat-sink in the form of the copper area on the printed circuit board. The DAP is physically
connected to backside of the die, but is not internally connected to device ground. The DAP should
be soldered to the Ground Plane copper.
30040805
TO-263 THIN
Package
PSOP-8
PSOP-8
Type
2
Function
Function
LP38511MR-ADJ
LP38511MR-ADJ
LP38511TJ-ADJ
Package
Marking
PSOP 8 Pin Package
Top View
30040806
Tape and Reel
Tape and Reel
Supplied
Rail
As