TCF250-100T-RA-B-0.5 Tyco Electronics, TCF250-100T-RA-B-0.5 Datasheet - Page 22

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TCF250-100T-RA-B-0.5

Manufacturer Part Number
TCF250-100T-RA-B-0.5
Description
POLYSWITCH PTC RESET 0.1A CHIP
Manufacturer
Tyco Electronics
Series
PolySwitch®r
Datasheet

Specifications of TCF250-100T-RA-B-0.5

Current - Hold (ih) (max)
100mA
Package / Case
Non-Standard SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Max
-
Voltage - Max
-
Current - Trip (it)
-
R Min/max
-
Time To Trip
-
Other names
F03128-000
4
Solder Reflow
• Recommended reflow methods:
• Surface-mount devices are not
• Recommended maximum paste
• Devices can be cleaned using
Rework
• If a device is removed from the
• If reflow temperatures exceed recommended profile, devices may not meet the performance requirements.
• Leaded devices are not designed to be compatible with reflow manufacturing operations.
• Recommended solder/temperature exposure for leaded devices is designated in the environmental/
322
Solder Reflow and Rework Recommendations for Telecommunications and Surface-Mount Devices
IR, vapor phase oven, hot air
oven.
designed to be wave soldered to
the bottom side of the board
(with the exception of
miniSMDC014).
thickness of 0.25mm (0.010 in).
standard industry methods and
solvents.
board, it should be discarded
and replaced with a new device.
physical tables for the product family. Exposure to temperatures or duration at temperature in excess of
these values may lead to device not meeting performance requirements.
PolySwitch Telecommunications and Networking Resettable Devices
CAUTION:
300
250
200
100
150
50
0
Preheating
30 to 90
Figure T21
Soldering
10 to 20
Time(s)
Cooling
120
Raychem Circuit Protection

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