MCP1727-2502E/SN Microchip Technology, MCP1727-2502E/SN Datasheet - Page 19
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MCP1727-2502E/SN
Manufacturer Part Number
MCP1727-2502E/SN
Description
IC REG LDO 1.5A 2.5V 8SOIC
Manufacturer
Microchip Technology
Specifications of MCP1727-2502E/SN
Regulator Topology
Positive Fixed
Voltage - Output
2.5V
Voltage - Input
Up to 6V
Voltage - Dropout (typical)
0.33V @ 1.5A
Number Of Regulators
1
Current - Output
1.5A (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Primary Input Voltage
6V
Output Voltage Fixed
2.5V
Dropout Voltage Vdo
330mV
No. Of Pins
8
Output Current
1.5A
Operating Temperature Range
-40°C To +125°C
Peak Reflow Compatible (260 C)
Yes
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
6 V
Output Voltage
2.5 V
Output Type
Fixed
Dropout Voltage (max)
0.55 V at 1.5 A
Line Regulation
0.05 % / V
Load Regulation
0.5 %
Voltage Regulation Accuracy
2 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP1727-2502E/SN
Manufacturer:
Microchip Technology
Quantity:
135
MCP1727
4.9
Overtemperature Protection
The MCP1727 LDO has temperature-sensing circuitry
to prevent the junction temperature from exceeding
approximately 150
C. If the LDO junction temperature
°
does reach 150
C, the LDO output will be turned off
°
until the junction temperature cools to approximately
140
C, at which point the LDO output will automatically
°
resume normal operation. If the internal power
dissipation continues to be excessive, the device will
again shut off. The junction temperature of the die is a
function of power dissipation, ambient temperature
and package thermal resistance. See Section 5.0
“Application Circuits/Issues” for more information
on LDO power dissipation and junction temperature.
© 2007 Microchip Technology Inc.
DS21999B-page 19