AP7167-SPG-13 Diodes Inc, AP7167-SPG-13 Datasheet - Page 10

• Manufacturer Part Number: AP7167-SPG-13
• Description: IC REG LDO 1.2A ADJ VOLT 8-SOIC
• Manufacturer: Diodes Inc

Specifications of AP7167-SPG-13

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.8 ~ 5 V
• Voltage - Input: 2.2 ~ 5.5 V
• Voltage - Dropout (typical): 0.5V @ 1A
• Number Of Regulators: 1
• Current - Output: 1.2A (Max)
• Current - Limit (min): 1.2A
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 5.5 V
• Output Voltage: 0.8 V to 5 V
• Output Type: Adjustable
• Dropout Voltage (max): 0.8 V at 1 A
• Output Current: 1.2 A
• Line Regulation: 0.02 % / V
• Load Regulation: 1.5 %
• Voltage Regulation Accuracy: 3 %
• Maximum Power Dissipation: 1.9 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Reference Voltage: 0.8 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AP7167-SPGDITR

Low Quiescent Current
The AP7167, consuming only around 150µA for all input
range and output loading, provides great power saving in
portable and low power applications.
Wide Output Range
The AP7167, with a wide output range of 0.8V to 5.0V,
provides a versatile solution for many portable and low
power applications.
Thermal Shutdown Protection
Thermal protection disables the output when the junction
temperature rises to approximately +155°C, allowing the
device to cool down. When the junction temperature
reduces to approximately +130°C the output circuitry is
enabled again. Depending on power dissipation, thermal
resistance,
protection circuit may cycle on and off. This cycling limits
the heat dissipation of the regulator, protecting it from
damage due to overheating.
AP7167
Document number: DS31252 Rev. 7 - 2
Application Notes
and
ambient
(Continued)
temperature,
the
thermal
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1.2A LOW DROPOUT REGULATOR WITH POK
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Power Dissipation
The device power dissipation and proper sizing of the
thermal plane that is connected to the thermal pad is
critical to avoid thermal shutdown and ensuring reliable
operation. Power dissipation of the device depends on
input voltage and load conditions and can be calculated
by:
The AP7167 is available in the DFN3030-10 and SOP-8L-
EP packages, both with exposed pad, which is the primary
conduction path for heat to the printed circuit board (PCB).
The pad can be connected to ground or be left floating;
however, to ensure the device will not overheat, it should
be attached to an appropriate amount of copper PCB area.
However, the maximum power dissipation that can be
handled by the device depends on the maximum junction
to
temperature, and maximum device junction temperature,
which can be approximated by the equation below:
P
P
D
D
(max@
ambient
=
(
V
IN
−
T
V
thermal
A
OUT
)
=
)
(
xI
+
OUT
150
resistance,
R
°
θ
C
JA
−
T
A
maximum
)
AP7167
© Diodes Incorporated
September 2010
ambient