MCP1702T-3302E/MB Microchip Technology, MCP1702T-3302E/MB Datasheet - Page 17
![IC REG LDO 3.3V 250MA SOT-89-3](/photos/12/58/125851/c04-029_mb_sml.jpg)
MCP1702T-3302E/MB
Manufacturer Part Number
MCP1702T-3302E/MB
Description
IC REG LDO 3.3V 250MA SOT-89-3
Manufacturer
Microchip Technology
Specifications of MCP1702T-3302E/MB
Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 13.2V
Voltage - Dropout (typical)
0.525V @ 250mA
Number Of Regulators
1
Current - Output
250mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
13.2 V
Output Voltage
3.3 V
Output Type
Fixed
Dropout Voltage (max)
0.725 V at 250 mA
Output Current
250 mA
Line Regulation
0.1 % / V
Load Regulation
1 %
Voltage Regulation Accuracy
0.4 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Primary Input Voltage
4.03V
Output Voltage Fixed
3.3V
Dropout Voltage Vdo
625mV
No. Of Pins
3
Voltage Regulator Case Style
SOT-89
Operating Temperature Range
-40°C To
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP1702T-3302E/MB
Manufacturer:
MICROCHIP
Quantity:
45 000
Company:
Part Number:
MCP1702T-3302E/MB
Manufacturer:
MICRO
Quantity:
1 000
Part Number:
MCP1702T-3302E/MB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
3-Lead Plastic Small Outline Transistor (CB) (SOT-23A)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
EIAJ Equivalent: SC-59
Drawing No. C04-130
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
c
B
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
Dimension Limits
E1
E
Units
p1
A2
E1
A1
n
p
E
D
L
φ
B
A
c
2
1
p
L
MIN
φ
p1
.035
.035
.000
.098
.055
.106
.014
.004
.012
0°
.037 BSC
.075 BSC
D
INCHES
NOM
–
–
–
–
–
–
–
–
–
A1
A
3
MAX
.055
.006
.118
.122
.022
.014
.019
.051
.071
10°
MIN
0.90
0.90
0.00
2.50
1.40
2.70
0.35
0.10
0.30
0°
MILLIMETERS*
0.95 BSC
1.90 BSC
Revised 09-14-05
NOM
MCP1702
–
–
–
–
–
–
–
–
–
–
3
DS22008A-page 17
MAX
1.40
1.30
0.15
3.00
1.80
3.10
0.55
0.35
0.50
10°
A2