MCP1703T-1802E/MB Microchip Technology, MCP1703T-1802E/MB Datasheet - Page 14
![IC REG LDO 1.8V 200MA SOT89-3](/photos/12/58/125851/c04-029_mb_sml.jpg)
MCP1703T-1802E/MB
Manufacturer Part Number
MCP1703T-1802E/MB
Description
IC REG LDO 1.8V 200MA SOT89-3
Manufacturer
Microchip Technology
Specifications of MCP1703T-1802E/MB
Regulator Topology
Positive Fixed
Voltage - Output
1.8V
Voltage - Input
2.7 ~ 16 V
Number Of Regulators
1
Current - Output
50mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Primary Input Voltage
16V
Output Voltage Fixed
1.8V
Dropout Voltage Vdo
750mV
No. Of Pins
3
Output Current
250mA
Operating Temperature Range
-40°C To +125°C
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Dropout (typical)
-
Current - Limit (min)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP1703T-1802E/MBTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1703T-1802E/MB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP1703
6.0
6.1
The MCP1703 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1703 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
The
temperature specified for the MCP1703 is +125
estimate the internal junction temperature of the
MCP1703, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (Rθ
ambient for the SOT-23A pin package is estimated at
336
DS22049F-page 14
Where:
I
50 mA
OUT
V
Input Voltage Range = 2.7V to 4.8V
°
P
V
1.8V
V
OUT(MIN)
C/W.
LDO
OUT
IN(MAX)
maximum
P
APPLICATION CIRCUITS &
ISSUES
Typical Application
Power Calculations
LDO
Package Type = SOT-23A
V
=
IN
APPLICATION INPUT CONDITIONS
V
POWER DISSIPATION
IN
JA
(
OUT
). The following equation can be used to
V
). The thermal resistance from junction to
maximum = 4.8V
IN MAX )
= LDO Pass device internal power
= Maximum input voltage
= LDO minimum output voltage
C
1 µF Ceramic
OUT
(
typical = 1.8V
V
GND
dissipation
OUT
I
continuous
OUT
MCP1703
Typical Application Circuit.
)
–
= 50 mA maximum
V
OUT MIN
V
(
IN
operating
)
) I
V
2.7V to 4.8V
×
IN
1 µF Ceramic
C
OUT MAX )
IN
(
junction
°
C
)
.
To
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
EQUATION 6-5:
Where:
Where:
Where:
Where:
P
T
T
T
T
T
P
P
T
D(MAX)
A(MAX)
J(RISE)
J(RISE)
J(MAX)
J(MAX)
TOTAL
TOTAL
AMAX
Rθ
Rθ
Rθ
T
T
JA
JA
JA
A
J
T
J MAX
P
(
= Maximum continuous junction
= Total device power dissipation
= Thermal resistance from
= Maximum ambient temperature
D MAX
= Maximum device power dissipation
= Maximum continuous junction
= Maximum ambient temperature
= Thermal resistance from
= Rise in device junction temperature
= Maximum device power dissipation
= Thermal resistance from junction to
= Junction temperature
= Rise in device junction temperature
= Ambient temperature
T
(
J RISE
(
temperature
junction-to-ambient
temperature
junction-to-ambient
over the ambient temperature
ambient
over the ambient temperature
)
T
=
)
J
=
P
)
=
TOTAL
=
(
---------------------------------------------------
T
© 2011 Microchip Technology Inc.
T
P
J RISE
J MAX
(
(
D MAX
(
×
Rθ
Rθ
)
)
+
–
)
JA
JA
×
T
T
A
A MAX
Rθ
+
(
T
JA
AMAX
)
)