TC2117-3.3VDBTR Microchip Technology, TC2117-3.3VDBTR Datasheet - Page 10

• Manufacturer Part Number: TC2117-3.3VDBTR
• Description: IC CMSO LDO 3.3V 800MA SOT223-3
• Manufacturer: Microchip Technology

Specifications of TC2117-3.3VDBTR

• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 6V
• Voltage - Dropout (typical): 1.2V @ 800mA
• Number Of Regulators: 1
• Current - Output: 800mA (Min)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Primary Input Voltage: 4.8V
• Output Voltage: 3.3V
• Dropout Voltage Vdo: 450mV
• No. Of Pins: 3
• Output Current: 800mA
• Voltage Regulator Case Style: SOT-223
• Operating Temperature Range: -40°C To +125°C
• Output Voltage Fixed: 3.3V
• Rohs Compliant: Yes
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 6 V
• Output Type: Fixed
• Dropout Voltage (max): 30 mV
• Line Regulation: 0.001 %
• Load Regulation: 0 % / mA
• Voltage Regulation Accuracy: 0.5 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Details
• Other names: TC21173.3VDBTR

TC2117
3-Lead Plastic (EB) (DDPAK)
DS21665C-page 10
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically, exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: TO-252
Drawing No. C04-011
Number of Pins
Pitch
Overall Height
Standoff
Overall Width
Exposed Pad Width
Molded Package Length
Overall Length
Exposed Pad Length
Lead Thickness
Pad Thickness
Lower Lead Width
Upper Lead Width
Foot Length
Pad Length
Foot Angle
Mold Draft Angle
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
D1
See ASME Y14.5M
See ASME Y14.5M
b1
b
1
TOP VIEW
Dimension Limits
E
e
§
c
Units
D2
E1
D1
c2
b1
L3
A1
E
D
b
L
φ
α
e
A
c
D
L3
φ
MIN
.014
.170
.000
.385
.330
.549
.045
.026
.049
.068
.045
--
D2
3°
1.00 BSC
.256 REF
.303 REF
INCHES*
L
NOM
BOTTOM VIEW
.177
.005
.398
.350
.577
.020
.032
.050
--
--
--
--
--
3
E1
MAX
.183
.010
.410
.370
.605
.026
.055
.037
.110
.067
.051
8°
7°
(5X)
α
MIN
13.94
4.32
0.00
9.78
8.38
0.36
1.14
0.66
1.24
1.73
1.14
--
c2
3°
MILLIMETERS
2.54 BSC
© 2006 Microchip Technology Inc.
6.50 REF
7.70 REF
NOM
14.66
10.11
Revised 07-19-05
4.50
0.13
1.27
8.89
0.51
0.81
--
--
--
--
--
3
MAX
15.37
10.41
4.65
0.25
9.40
0.66
1.40
0.94
1.30
2.79
1.70
8°
7°