LT3032EDE#TRPBF Linear Technology, LT3032EDE#TRPBF Datasheet - Page 17

• Manufacturer Part Number: LT3032EDE#TRPBF
• Description: IC REG LDO ADJ .15A DUAL 14DFN
• Manufacturer: Linear Technology

Specifications of LT3032EDE#TRPBF

• Regulator Topology: Positive and Negative Adjustable
• Voltage - Output: ±1.22 ~ ±20 V
• Voltage - Input: ±2.3 ~ ±20 V
• Voltage - Dropout (typical): 0.27V @ 150mA, 0.3V @ -150mA
• Number Of Regulators: 2
• Current - Output: 150mA
• Current - Limit (min): 170mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

applicaTions inForMaTion
If wiring modifications are not permissible for the
applications, including series resistance between the
power supply and the input of the LT3032 also stabilizes
the application. As little as 0.1Ω to 0.5Ω, often less,
is effective in damping the LC resonance. If the added
impedance between the power supply and the input is
unacceptable, adding ESR to the input capacitor also
provides the necessary damping of the LC resonance.
However, the required ESR is generally higher than the
series impedance required.
Thermal Considerations
The power handling capability of the device is limited by
the maximum rated junction temperature (125°C). The
power dissipated by the device is made up of the following
components:
1. Output current of each side multiplied by the respective
2. GND pin current for each side multiplied by its input
The GND pin current of each side is found by examining
the GND Pin Current curves in the Typical Performance
Characteristics. Total power dissipation equals the sum
for both channels of the components listed above.
The LT3032 has internal thermal limiting designed to protect
each side of the regulator during overload conditions. For
continuous normal conditions, the maximum junction
temperature rating of 125°C must not be exceeded. It is
important to give careful consideration to all sources of
thermal resistance from junction to ambient. Additional
heat sources mounted nearby must also be considered.
input/output voltage differential: (I
and
voltage: (I
GND
)(V
IN
)
OUT
)(V
IN
to V
OUT
),
The LT3032 is a surface mount device and heat sinking is
accomplished by using the heat spreading capabilities of
the PC board and its copper traces. Copper board stiffeners
and plated through-holes can also be used to spread the
heat generated by power devices.
Note that the Exposed Pads (Pins 15 and 16) are elect-
rically connected to ground (GND) and the negative input
(INN) respectively.
The following table lists thermal resistance as a function
of copper area on a fixed board size. All measurements
were taken in still air on a 4-layer FR-4 board with 1oz
solid internal planes and 2oz external trace planes with a
total finished board thickness of 1.6mm.
Table 3. DE Package, 14-Lead DFN
*Device is mounted on topside
For further information on thermal resistance and using
thermal information, refer to JEDEC standard JESD51,
notably JESD51-12.
PCB layers, copper weight, board layout and thermal
vias affect the resultant thermal resistance. This table
provides thermal resistance numbers for best-case 4-layer
boards with 1oz internal and 2oz external copper. Modern,
multilayer PCBs may not be able to achieve quite the same
level performance as found in this table.
TOPSIDE*
2500mm
1000mm
225mm
100mm
COPPER AREA
2
2
2
2
BACKSIDE
2500mm
2500mm
2500mm
2500mm
2
2
2
2
BOARD AREA
2500mm
2500mm
2500mm
2500mm
LT3032 Series
2
2
2
2
(JUNCTION-TO-AMBIENT)
THERMAL RESISTANCE
32°C/W
33°C/W
38°C/W
43°C/W
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