LP3855EMPX-1.8/NOPB National Semiconductor, LP3855EMPX-1.8/NOPB Datasheet - Page 15
![IC REG LDO 1.5A 1.8V SOT223-5](/photos/12/65/126584/pkg_mp05a_sml.jpg)
LP3855EMPX-1.8/NOPB
Manufacturer Part Number
LP3855EMPX-1.8/NOPB
Description
IC REG LDO 1.5A 1.8V SOT223-5
Manufacturer
National Semiconductor
Datasheet
1.LP3852EMP-3.3NOPB.pdf
(20 pages)
Specifications of LP3855EMPX-1.8/NOPB
Regulator Topology
Positive Fixed
Voltage - Output
1.8V
Voltage - Input
2.5 ~ 7 V
Number Of Regulators
1
Current - Output
1.5A (Max)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SOT-223 (4 leads + Tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Dropout (typical)
-
Current - Limit (min)
-
Other names
LP3855EMPX-1.8
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking.
θ
a typical PCB with 1 ounce copper and no solder mask over
the copper area for heat sinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
JA
FIGURE 5. θ
of TO-263 package for different copper area sizes, using
JA
vs Copper (1 Ounce) Area for TO-263
package
Figure 5
shows a curve for the
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15
value for θ
32°C/W.
Figure 6
TO-263 packages for different ambient temperatures, assum-
ing θ
125°C.
FIGURE 6. Maximum power dissipation vs ambient
JA
is 35°C/W and the maximum junction temperature is
shows the maximum allowable power dissipation for
JA
temperature for TO-263 package
for the TO-263 package mounted to a PCB is
www.national.com
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