MAX603CSA Maxim Integrated Products, MAX603CSA Datasheet - Page 8

• Manufacturer Part Number: MAX603CSA
• Description: IC LDO REG LOW-IQ 5V/ADJ 8-SOIC
• Manufacturer: Maxim Integrated Products

Specifications of MAX603CSA

• Regulator Topology: Positive Fixed or Adjustable
• Voltage - Output: 5V, 1.25 ~ 11 V
• Voltage - Input: 2.7 ~ 11.5 V
• Voltage - Dropout (typical): 0.32V @ 500mA
• Number Of Regulators: 1
• Current - Output: 500mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 11.5 V
• Output Voltage: 1.25 V to 11 V, 5 V
• Output Type: Adjustable, Fixed
• Dropout Voltage (max): 0.22 V at 200 mA
• Output Current: 500 mA
• Line Regulation: 7 mV
• Load Regulation: 60 mV
• Voltage Regulation Accuracy: 3 %
• Maximum Power Dissipation: 1.8 W
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Reference Voltage: 1.2 V
• Case: SOP8
• Dc: 00+
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Limit (min): -

air,
chosen, and
printed circuit board, copper traces and other materials
to the surrounding air. The 8-pin SOIC package for the
MAX603/MAX604 features a special lead frame with a
lower thermal resistance and higher allowable power
dissipation. The thermal resistance of this package is
pin plastic DIP package and
ceramic DIP package.
The GND pins of the MAX603/MAX604 SOIC package
perform the dual function of providing an electrical con-
nection to ground and channeling heat away. Connect
all GND pins to ground using a large pad or ground
plane. Where this is impossible, place a copper plane
on an adjacent layer. The pad should exceed the
dimensions in Figure 4.
Figure 4 assumes the IC is an 8-pin SOIC package, is
soldered directly to the pad, has a +125°C maximum
junction temperature and a +25°C ambient air tempera-
ture, and has no other heat sources. Use larger pad
sizes for other packages, lower junction temperatures,
higher ambient temperatures, or conditions where the IC
is not soldered directly to the heat-sinking ground pad.
The MAX603/MAX604 can regulate currents up to
500mA and operate with input voltages up to 11.5V, but
not simultaneously. High output currents can only be
sustained when input-output differential voltages are
5V/3.3V or Adjustable, Low-Dropout,
Low I
Figure 4. Typical Maximum Power Dissipation vs. Ground Pad
Size.
8
JB
_______________________________________________________________________________________
= 42°C/W, compared with
JB
(or
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.2
1.3
JC
Q
) is the thermal resistance of the package
BA
, 500mA Linear Regulators
COPPER GROUND PAD AREA
is the thermal resistance through the
POWER DISSIPATION vs.
GROUND PAD AREA
6.5
1
MAX603, V
8-PIN SO PACKAGE
PAPER EPOXY BOARD
SINGLE SIDED
1oz. COPPER
T
T
J
A
= +125°C
= +25°C STILL AIR
JB
JB
= 125°C/W for an 8-pin
OUT
= 110°C/W for an 8-
= 5V
10
65
130
20
(in
(cm
2
)
2
)
low, as shown in Figure 5. Maximum power dissipation
depends on packaging, board layout, temperature, and
air flow. The maximum output current is:
where P
The MAX603/MAX604 has a unique protection scheme
that limits reverse currents when the input voltage falls
below the output. It monitors the voltages on IN and
OUT and switches the IC’s substrate and power bus to
Figure 5. Power Operating Regions: Maximum Output Current
vs. Differential Supply Voltage
I
OUT max
MAX
MAXIMUM OUTPUT CURRENT vs. SUPPLY VOLTAGE
700
600
500
400
300
200
100
700
600
500
400
300
200
100
0
0
4
2
is derived from Figure 4.
3
5
MAXIMUM CONTINUOUS CURRENT LIMIT
MAXIMUM CONTINUOUS CURRENT LIMIT
OPERATING
REGION AT
T
T
OPERATING
REGION AT
T
T
4
A
J
A
J
= +125°C
= +125°C
6
= +25°C
= +25°C
Reverse-Current Protection
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
5
7
V
6
IN
P
MAX604
MAX603
MAX
8
HIGH-POWER SOIC
7
- V
PLASTIC DIP
CERAMIC DIP
CERAMIC DIP
HIGH-POWER
PLASTIC DIP
8
9
OUT
9
10
T - T
SOIC
10
J
11
11
100 C
12
12
A
13
13