ECLAMP2342N.TCT Semtech, ECLAMP2342N.TCT Datasheet - Page 4

• Manufacturer Part Number: ECLAMP2342N.TCT
• Description: IC ESD/EMI PROT LCD INTRFC 16QFN
• Manufacturer: Semtech
• Series: EClamp™r

Specifications of ECLAMP2342N.TCT

• Filter Type: Signal Line
• Voltage - Rated: 5V
• Mounting Type: Surface Mount
• Termination Style: Surface Mount (SMD,SMT)
• Package / Case: 16-QFN
• Applications: General Purpose
• Number Of Circuits: 8
• Voltage - Working: 5V
• Technology: Mixed Technology
• Diode Type: Bidirectional TVS
• Operating Voltage: 5V
• Diode Case Style: QFN
• No. Of Pins: 16
• Peak Reflow Compatible (260 C): Yes
• Capacitance, Cd: 16pF
• Breakdown Voltage Vbr: 8V
• No. Of Lines Protected Max: 8
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Other names: ECLAMP2342NTR

Device Connection
The EClamp2342N is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is housed in a 16-pin Quad Flat No-Lead
(QFN) package. Electrical connection is made via 16
pins located at the bottom of the device. A center tab
serves as the ground connection. Pin connections are
noted in the table to the right. The device is symmetri-
cal and designed for easy PCB routing as shown in the
layout example below. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
PROTECTION PRODUCTS
Applications Information
2004 Semtech Corp.
Layout Example (Top Side View)
1 2
1 2
3 4 5 6
Outputs
Inputs
3 4 5 6
7 8
7 8
4
3
5
6
4
Pin Identification and Configuration (Top Side View)
, 1
C
e
, 2
I/O Lines 1 - 4
3
t n
P
-
1
r e
LOW PASS FILTER
LOW PASS FILTER
n i
LOW PASS FILTER
LOW PASS FILTER
1
1
0
T
-
b a
Pin Configuration and Schematic
1
6
1
2
3
4
16 15 14 13
5 6 7 8
O
n I
u
p
p t
1
16
15
2
t u
t u
L ,
L
EClamp2342N
n i
n i
7
8
9
d I
10
s e
s e
e
n
r G
, 1
, 1
f i t
u o
, 2
I/O Lines 5 - 8
c i
, 2
12
11
10
9
LOW PASS FILTER
LOW PASS FILTER
LOW PASS FILTER
n
LOW PASS FILTER
t a
, 3
PRELIMINARY
d
, 3
o i
, 4
www.semtech.com
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8
8
14
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