MMT08B350T3G ON Semiconductor, MMT08B350T3G Datasheet
MMT08B350T3G
Specifications of MMT08B350T3G
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MMT08B350T3G Summary of contents
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... TSM Device "300 MMT08B350T3 di/dt A/ms MMT08B350T3G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. ...
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THERMAL CHARACTERISTICS Characteristic Operating Temperature Range Blocking or Conducting State Overload Junction Temperature − Maximum Conducting State Only Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds ELECTRICAL CHARACTERISTICS forward and reverse polarities. Characteristics Breakover Voltage (Both ...
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V = 50V D1 10 1.0 0.1 0.01 0.001 −60 −40 − TEMPERATURE (°C) Figure 1. Typical Off−State Current versus Temperature 440 430 420 410 400 390 380 −60 −40 − ...
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MMT08B350T3 TIP GND OUTSIDE PLANT RING PPTC* TIP GND OUTSIDE PLANT RING PPTC* *Polymeric PTC (positive temperature coefficient) overcurrent protection device HEAT COIL TIP OUTSIDE GND PLANT RING HEAT COIL http://onsemi.com TELECOM EQUIPMENT TELECOM EQUIPMENT TELECOM EQUIPMENT 4 ...
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... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...