B72590D50A60 EPCOS Inc, B72590D50A60 Datasheet - Page 15

• Manufacturer Part Number: B72590D50A60
• Description: CERADIODE 5.6VDC 10A 0402
• Manufacturer: EPCOS Inc
• Series: CeraDioder

Specifications of B72590D50A60

• Package / Case: 0402 (1005 Metric)
• Varistor Voltage: 6.4V
• Current-surge: 10A
• Number Of Circuits: 1
• Maximum Dc Volts: 5.6VDC
• Polarity: Bidirectional
• Clamping Voltage: 24 V
• Operating Voltage: 5.6 V
• Breakdown Voltage: 6.4 V
• Termination Style: SMD/SMT
• Peak Surge Current: 10 A
• Peak Pulse Power Dissipation: 320 W
• Capacitance: 180 pF
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Diode Type: ESD Protection
• Clamping Voltage Vc Max: 24V
• Diode Case Style: 0402
• Operating Temperature Range: -40°C To +85°C
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Energy: -
• Maximum Ac Volts: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-3418-2; B72590D 50A 60; B72590D0050A060; CDS2C05GTA

4
Test
Wettability
Leaching
resistance
Tests of
resistance to
soldering heat
for SMDs
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
Please read Cautions and warnings and
Important notes at the end of this document.
CeraDiodes
Standard series
Solderability tests
As single chip
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
Test conditions /
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215 3 C for
3 0.3 s
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 255 5 C
for 10 1 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Page 15 of 22
Test conditions /
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 5 C
for 3 0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 5 C
for 10 1 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
As mounted on substrate
Criteria / test results
Covering of 95%
of end termination,
checked by visual
inspection
No leaching of
contacts
Capacitance change:
15%
C 15%