B72714A8140S160 EPCOS Inc, B72714A8140S160 Datasheet - Page 22

VARISTOR ARRAY 14VRMS 0508

B72714A8140S160

Manufacturer Part Number
B72714A8140S160
Description
VARISTOR ARRAY 14VRMS 0508
Manufacturer
EPCOS Inc
Datasheet

Specifications of B72714A8140S160

Package / Case
0508 (1220 Metric)
Varistor Voltage
32V
Number Of Circuits
4
Maximum Ac Volts
14VAC
Maximum Dc Volts
16VDC
Voltage Rating Dc
16 V
Clamping Voltage
59 V
Surge Energy Rating
30 mJ
Capacitance
15 pF
Operating Temperature Range
- 40 C to + 85 C
Mounting
SMD/SMT
Voltage Rating Ac
17 V
Peak Surge Current
10 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Energy
-
Current-surge
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-3427-2
CA05P4S14THSG

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B72714A8140S160
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
High-speed series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 22 of 30
As mounted on substrate

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