CT1206K30G EPCOS Inc, CT1206K30G Datasheet - Page 73
![VARISTOR 30VRMS 1206 SMD](/photos/1/40/14091/495-varistor_tvs_series_1206_sml.jpg)
CT1206K30G
Manufacturer Part Number
CT1206K30G
Description
VARISTOR 30VRMS 1206 SMD
Manufacturer
EPCOS Inc
Series
CT Automotiver
Datasheet
1.CT0402M4G.pdf
(81 pages)
Specifications of CT1206K30G
Varistor Voltage
47V
Current-surge
200A
Number Of Circuits
1
Maximum Ac Volts
30VAC
Maximum Dc Volts
38VDC
Energy
1.1J
Package / Case
1206 (3216 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-2602-2
B72520T 300K 62
B72520T0300K062
B72520T300K62
B72520T300K62V7
B72520T 300K 62
B72520T0300K062
B72520T300K62
B72520T300K62V7
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CT1206K30G
Manufacturer:
TDK
Quantity:
60 000
Company:
Part Number:
CT1206K30G
Manufacturer:
EPCOS Inc
Quantity:
77 810
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 73 of 81
As mounted on substrate