PR2512FKF070R004L Yageo, PR2512FKF070R004L Datasheet - Page 5

• Manufacturer Part Number: PR2512FKF070R004L
• Description: RES 0.004 OHM 1W 1% 2512 SMD
• Manufacturer: Yageo
• Series: PRr
• Type: Thin Film Chip Resistorsr

Specifications of PR2512FKF070R004L

• Resistance (ohms): 0.004
• Power (watts): 1W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.248" L x 0.126" W (6.30mm x 3.20mm)
• Height: 0.022" (0.55mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 2512 (6432 Metric)
• Resistance In Ohms: 0.004
• Case: 2512 (6432 metric)
• Resistance: 4 mOhms
• Power Rating: 1 Watt
• Product: Thin Film Resistors SMD
• Operating Temperature Range: - 55 C to + 155 C
• Dimensions: 3.2 mm W x 6.3 mm L x 0.55 mm H
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 311-0.004AGTR

TESTS AND REQUIREMENTS
TEST
Life/
Endurance
High
Temperature
Exposure/
Endurance
at
category
temperature
Moisture
Resistance
Thermal
Shock
Short time
overload
Board Flex/
Bending
Solderability
- Leaching
- Resistance
- Wetting
to Soldering
Heat
upper
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
MIL-STD-202 Method 106G
MIL-STD-202G Method
107G
IEC 60115-1 4.13
IEC 60068-2-21
IPC/JEDEC J-STD-002B
test B
IPC/JEDEC J-STD-002B
test D
IEC 60068-2-58
Chip Resistor Surface Mount
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at 155±5 °C,unpowered
Each temperature / humidity cycle is defined at
8 hours (Method 106G), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, un-powered Parts mounted on
test-boards, without condensation on parts
Measurement at 24±2 hours after test
conclusion.
-55/+125 °C
Note: Number of cycles required is 300.
Devices
unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 sec at room
temperature
Chips mounted on a 90mm glass epoxy resin
PCB(FR4)
2 mm bending
Bending time:
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: Method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Leadfree solder, 260 °C, 30 seconds
immersion time
Condition B, no pre-heat of samples
Leadfree solder, 260±5 °C, 10±1seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
PR
SERIES
60±1
2512(RoHS Compliant)
seconds
REQUIREMENT
± (1.0 % + 0.0005Ω)
± (1.0 % + 0.0005Ω)
± ( 0.5% + 0.0005Ω)
± ( 1.0% + 0.0005Ω)
± (1.0 % + 0.0005Ω)
Well tinned (>95%
covered)
No visible damage
No visible damage
± ( 0.5% + 0.0005Ω)
No visible damage
± (1.0% + 0.0005Ω)
No visible damage
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