CN1210K14G EPCOS Inc, CN1210K14G Datasheet - Page 73

VARISTOR 14VRMS 1210 SMD

CN1210K14G

Manufacturer Part Number
CN1210K14G
Description
VARISTOR 14VRMS 1210 SMD
Manufacturer
EPCOS Inc
Series
CN Standardr
Datasheets

Specifications of CN1210K14G

Energy
1.5J
Varistor Voltage
22V
Current-surge
400A
Number Of Circuits
1
Maximum Ac Volts
14VAC
Maximum Dc Volts
18VDC
Package / Case
1210 (3225 Metric)
Technology
Metal Oxide
Capacitance Value
2000pF
Clamping Current
2.5A
Clamping Voltage
38V
Ac Voltage Rating (max)
14VAC
Dc Voltage Rating (max)
18VDC
Operating Temp Range
-55C to 125C
Mounting
Surface Mount
Surge Current (max)
400A
Size Code
1210
Product Length (mm)
3.2mm
Product Depth (mm)
2.5mm
Product Height (mm)
1.7mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72530V 140K 62
B72530V0140K062
B72530V140K62

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CN1210K14G
Manufacturer:
EPCOS
Quantity:
90 150
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 73 of 81
As mounted on substrate

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