CU3225K115G2 EPCOS Inc, CU3225K115G2 Datasheet - Page 20
![VARISTOR STD 115VRMS 3225 SMD](/photos/1/41/14150/cu3225_series_sml.jpg)
CU3225K115G2
Manufacturer Part Number
CU3225K115G2
Description
VARISTOR STD 115VRMS 3225 SMD
Manufacturer
EPCOS Inc
Series
CUr
Datasheet
1.CU3225K250G2.pdf
(35 pages)
Specifications of CU3225K115G2
Varistor Voltage
180V
Current-surge
400A
Number Of Circuits
1
Maximum Ac Volts
115VAC
Maximum Dc Volts
150VDC
Energy
3.6J
Package / Case
Non-Standard SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72650M 111K 72
B72650M0111K072
B72650M111K72
B72650M0111K072
B72650M111K72
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CU3225K115G2
Manufacturer:
TDK-EPCOS
Quantity:
20 000
Soldering directions
1
1.1
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
Terminations
Nickel barrier termination
Silver-palladium termination
Page 20 of 35