CRCW0603150RFKTA Vishay, CRCW0603150RFKTA Datasheet - Page 6

RES 150 OHM 1/10W 1% 0603 SMD

CRCW0603150RFKTA

Manufacturer Part Number
CRCW0603150RFKTA
Description
RES 150 OHM 1/10W 1% 0603 SMD
Manufacturer
Vishay
Series
CRCWr
Type
Thick Filmr

Specifications of CRCW0603150RFKTA

Resistance
150Ohm
Temperature Coefficient
±100ppm/°C
Resistance (ohms)
150
Power (watts)
0.1W, 1/10W
Composition
Thick Film
Tolerance
±1%
Size / Dimension
0.061" L x 0.033" W (1.55mm x 0.85mm)
Height
0.018" (0.45mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0603 (1608 Metric)
Resistance In Ohms
150
Case
0603 (1608 metric)
Power Rating(s)
1/10W
Tolerance (+ Or -)
1%
Mounting Style
Surface Mount
Operating Temp Range
-55C to 155C
Case Style
Molded
Military Standard
Not Required
Failure Rate
Not Required
Product Length (mm)
1.55mm
Product Depth (mm)
0.85mm
Product Height (mm)
0.45mm
Resistance Tolerance
± 1%
Power Rating
100mW
Voltage Rating
75V
Resistor Element Material
Thick Film
Peak Reflow Compatible (260 C)
No
Termination Type
SMD
Leaded Process Compatible
No
Mounting Type
Surface Mount
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
Other names
CRCW0603 100 150R 1% RT1
CRCW06031500FRT1
D/CRCW e3
Vishay
www.vishay.com
130
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Rapid change of
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Standard Thick Film Chip Resistors
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
This datasheet is subject to change without notice.
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C;  90 % RH;
55 °C;  90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) C
1000 cycles
 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
 U
; 60 s
;
x R
max.
;
thickfilmchip@vishay.com
±0.25 % R + 0.05)
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
No visible damage, no open circuit in bent position
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
PERMISSIBLE CHANGE (R)
Good tinning ( 95 % covered)
Good tinning ( 95 % covered)
No flashover or breakdown
± (0.25 % R + 0.05 )
SIZE 0402 to 2512
No visible damage
REQUIREMENTS
no visible damage
no visible damage
1  to 10 M
± (0.5 % R + 0.05 )
±0.5 % R + 0.05)
Document Number: 20035
www.vishay.com/doc?91000
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
Revision: 08-Mar-11
± 5 %

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