RG1005V-3830-B-T1 Susumu, RG1005V-3830-B-T1 Datasheet - Page 12
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RG1005V-3830-B-T1
Manufacturer Part Number
RG1005V-3830-B-T1
Description
RES 383 OHM 1/16W .1% 0402
Manufacturer
Susumu
Series
RGr
Datasheet
1.RG1005P-103-D-T10.pdf
(16 pages)
Specifications of RG1005V-3830-B-T1
Resistance (ohms)
383
Power (watts)
0.063W, 1/16W
Composition
Thin Film
Temperature Coefficient
±5ppm/°C
Tolerance
±0.1%
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height
0.014" (0.35mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0402 (1005 Metric)
Resistance In Ohms
383
Case
0402 (1005 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
12
Recommended land pattern
■RG・RGH series
■RM series
RM2012
Power Derating
①Rated Power
②Rated voltage
Recommended Reflow
●Recommended reflow temperature profile
Design Supportive Data
300
250
200
150
100
The standard ambient temperature is 30℃. When an
ambient temperature exceeds 30℃, the maximum
load power is calculated by multiplying the rated
power with the ratio derived from the power derating
curve
The rated voltage is the corresponding voltage of
DC or AC (commercially used frequency) current to
50
0
E= R×P
a
b
Preheating stage
0.4∼0.6
Solder Resist
Solder Resist
Time→
0.7∼0.9
1.8∼2.0
(2.0)
Reflow stage
c
E:Rated voltage(V)
P:Rated power(W)
R:Rated resistance(Ω)
Peak
RG1005, RGH1005
RG2012, RGH2012
Dimention : mm
RG1608
RG3216
Series
RM3216
●Part's surface temperature
●Solder composition : Sn-Ag-Cu solder
●Repetition :
peak temperature
Pre-heat
0.5
1.0
1.2
2.2
reflow
a
0.6∼0.8
1.6
3.0
4.0
5.0
Dimention : mm
b
Solder Resist
Solder Resist
2.6∼3.2
1.4∼1.6
1.65
0.6
1.2
2.0
3.2
c
●Power derating curve (RG, RM, RGH series)
(Cooling between the two reflow is required.)
100
up to 2 times
50
0
−55
130∼180℃
Over 220℃
240∼250℃
Dimention : mm
Ambient temperature (℃)
0
60∼90sec.
30∼90sec.
within 10sec.
85
155