75005-0204 Molex Inc, 75005-0204 Datasheet - Page 4
![CONN RECEPT 72POS 1.2MM VERT SMD](/photos/1/80/18088/75005-0204_sml.jpg)
75005-0204
Manufacturer Part Number
75005-0204
Description
CONN RECEPT 72POS 1.2MM VERT SMD
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75005r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75005-0204.pdf
(3 pages)
Specifications of 75005-0204
Connector Type
Differential Pair Array, Female
Number Of Positions
72
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm, 13mm, 15mm
Height Above Board
0.285" (7.24mm)
Pitch Spacing
1.2mm
No. Of Contacts
72
Gender
Receptacle
Contact Plating
Gold
No. Of Rows
2
Contact Termination
Surface Mount Vertical
Product Type
Receptacles
Mounting Style
Wire
Mounting Angle
Vertical
Number Of Positions / Contacts
16
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Voltage Rating
30 V
Current Rating
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
075005-0204
0750050204
750050204
WM17207TR
0750050204
750050204
WM17207TR
REVISION:
DOCUMENT NUMBER:
4.3 Additional Testing
B
Test # Board Thickness
Notes:
1
2
3
4
5
6
TS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
1) The sample size for sequence A consisted of 3 Assemblies (75005-0006 and 75003-0008).
2) The sample size for sequence B consisted of 30 Individual Contact Pairs and 1 Fully Powered
3) The sample size for sequence C consisted of 5 Assemblies (75005-0006 and 75003-0008).
4) The sample size for sequence D consisted of 24 chicklets of both types (75005-0006 and
5) The stressed test sequence consisted of 3 environmental sequences. Thermal Shock : 10
6) Reworked parts were subjected to 2 rework cycles.
Dielectric Withstanding Voltage (5.2.2)
Insulation Resistance (5.2.3)
Thermal Shock (5.4.1)
Humidity - Temp. Cycling (5.4.4)
Temperature Rise (5.4.8)
Mating Force (5.3.1)
Unmating Force (5.3.1)
Retention Force - Chicklet to Housing (5.3.6)
Axial Pull of Soldered Assemblies (5.3.7)
Side Load of Soldered Assemblies (5.3.8)
Plating Adhesion (5.4.9)
0.062
0.072
0.072
0.072
0.072
0.072
75003-0008).
Cycles of -40
Assembly. (This testing consisted of P/N 74874-0006 which was replaced by P/N’s 75005-
0006 and 75003-0008 however the electrical interface did not change.)
extremes. Temperature Cycling: 500 Cycles of -40
Ramp < 20
UCP2003-2204
2003 / 04 / 10
EIA 364 Samples
Unstressed - 50% Fill
Unstressed - Normal Process
Unstressed - Normal Process, Soldered Locating Pegs (10) 75005-2000 (10) 75003-2000
Stressed - Normal Process (see note 5)
Reworked Parts (see note 6)
Test or Examination
o
HIGH SPEED MEZZANINE
C/minute. Humidity: 500 Hours at 85
o
C to 65
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
o
C, 10 minute dwell at extremes, Ramp < 2 minutes between
Ken Stiles
Description
BOARD TO BOARD CONNECTOR SYSTEM
Test Sequence E
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
Additional Test Sequences
2, 5
A
1
3
4
CHECKED BY:
o
Ken Stiles
C and 85% RH
o
C to 65
B
1
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(10) 75005-2000 (10) 75003-2000
(4) 75005-0006 (4) 75003-0008
Receptacles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
C
1
2
o
C, 10 minute dwell at extremes,
D
1
Sample Size
E
2
1
Manny Banakis
APPROVED BY:
F
1
Plugs
SHEET No.
4
of
20