IT3M2-180P-28H(03) Hirose Electric Co Ltd, IT3M2-180P-28H(03) Datasheet

CONN INTERPOSER 180POS 28MM

IT3M2-180P-28H(03)

Manufacturer Part Number
IT3M2-180P-28H(03)
Description
CONN INTERPOSER 180POS 28MM
Manufacturer
Hirose Electric Co Ltd
Series
IT3r

Specifications of IT3M2-180P-28H(03)

Pitch
0.068" (1.75mm)
Connector Type
Interposer
Number Of Positions
180
Number Of Rows
36
Mounting Type
Stacking
Features
Locking
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
15mm ~ 40mm
Product Type
Receptacles
Mounting Style
SMD/SMT
Mounting Angle
Vertical
Number Of Positions / Contacts
180
Housing Material
Liquid Crystal Polymer (LCP)
Contact Material
Copper Alloy
Contact Plating
Gold
Voltage Rating
50 V
Current Rating
1 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
H11780 - CONN RCPT MOUNT SIDE 180POS SMDH11779 - CONN RCPT MATE SIDE 180POS SMD
Height Above Board
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
*IT3M2-180P-28H(03)
H11801

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IT3M2-180P-28H(03)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
135
Part Number:
IT3M2-180P-28H(03)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Contact Position
Signal integrity features
Stacking height variations
Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10
with skipped pin assignment.
Return Loss
NEW
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
High-Speed(10
IT3 Series
Stacking Height
100
200
300
17mm
Signal / Ground Configuration
Interposer
20mm
+
+
Gbps
Gbps) BGA Mezzanine Connectors
22mm
60
50
40
30
20
10
0
0
25mm
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
5
Flexibility
Mechanical features
Unique 3-piece structure for flexibility
Stacking heights from 15 to 40mm
( 15mmH is 2-piece)
Staggered 1.5mm
Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
Differential, single-ended, and power
Low mating/extracting forces
Wide misalignment tolerances for multiple
connector use
Both of SnPb and Pb-free are available
Excellent reflow solderability
Frequency (GHz)
26mm
10
15
28mm
ICR
IEEE spec
20
30mm
+
Gbps systems.
1.75mm ball grid array
-10
-20
-30
-40
-50
0
0
32mm
5
Frequency (GHz)
2010.02
38mm
10
15
RL
IEEE Spec
40mm
20
1

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IT3M2-180P-28H(03) Summary of contents

Page 1

NEW High-Speed(10 IT3 Series Interposer Signal / Ground Configuration Signal integrity features Insertion loss to Crosstalk Ratio (ICR) The ICR performance meets the extrapolated IEEE 802.3ap specification for 6.25Gbps with fully-populated pin assignment, and 10 with skipped pin assignment. Return ...

Page 2

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Product Specifications Rating Item 1. Insulation Resistance 2. Withstanding Voltage 3. Contact Resistance 4. Vibration 5. Cyclic Temperature and Humidity 6. Durability (Mating/Un-mating) Note1: Refer to IT3 derating curves on test report ...

Page 3

Ordering Information Receptacle Interposer IT3 Series High-Speed( BGA Gbps) ...

Page 4

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Signal Integrity Pin assignment For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the figures below. In the following data, one victim pair and eight aggressor ...

Page 5

Differential Insertion Loss The differential insertion loss is less than -2dB up to 12GHz S514 - 17mm Height Differential Return Loss The connector-only differential return ...

Page 6

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Differential Far-End Crosstalk (FEXT) Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk can be achieved by skipping pins. 0 -10 -20 -30 -40 -50 ...

Page 7

Receptacle Contact Positions Type Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle IT3 Series High-Speed(10 Solder Ball Material Part Number + Gbps) BGA Mezzanine Connectors CL No ...

Page 8

... IT3-300P-25H(03) 636-0160-6-03 IT3-100P-26H(03) 636-0165-0-03 IT3-200P-26H(03) 636-0110-8-03 IT3-300P-26H(03) 636-0135-9-03 8 Height Part Number (mm) 41.5 IT3-100P-28H(03) 15.8 16.6 17.0 59.0 IT3M2-180P-28H(03) 24.0 IT3-200P-28H(03) 41.5 18.8 19.6 20.0 IT3-300P-28H(03) 59.0 IT3-200P-30H(03) 41.5 IT3-300P-30H(03) 20.8 21.6 22.0 59.0 IT3-200P-32H(03) 24.0 IT3-300P-32H(03) 41.5 IT3-100P-38H(03) 23.8 24.6 25 ...

Page 9

PCB footprint (mounting foot pattern) Dimension (mm) IT3 Series High-Speed(10 Mounting Receptacle – IT3M Mating Receptacle – IT3D 100 180 / 200 15.75 33.25 28.10 45.60 30.10 47.50 + Gbps) BGA Mezzanine Connectors 300 50.75 63.10 65.10 9 ...

Page 10

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Spacers Spacers are required to support the PWB’s and protect the BGA solder joints. The recommended spacer height corresponds to the interposer stacking height as shown in the chart below: 10- 50mm ...

Page 11

Interposer installation Position interposer directly over mounting receptacle, aligning the polarity chamfers. If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap onto interposer and push straight down to engage the locking latches: *Installation caps ...

Page 12

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Daughter card removal To remove a daughter card, first remove the nuts from the reinforcing spacers, then lift the daughter card straight off the interposers, as shown right. Interposer removal 1) Hold ...

Page 13

Assembly reflow soldering profile Parameters 240 225 205 183 140 21 IT3 Series High-Speed(10 Eutectic (SnPb) Pb-Free Reflow Profile Reflow + Gbps) BGA Mezzanine Connectors Comment 260 250 230 217 160 21 13 ...

Page 14

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Mating self alignment +/-0.8 Mating tolerance Due to its 3-piece design, the IT3 connector system can accept mating tolerances ±0.3mm tolerance in the X-axis and up to ±0.2mm in ...

Page 15

Packaging information Please order per box with its Minimum Order Quantity (MOQ) of connectors contained. The number for each configuration is shown below. Receptacles This is also a packaging quantity, therefore please multiply integrally based on ...

Page 16

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Packaging information Interposers This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Ex.) 240pcs of IT3M-300S-BGA(57 ...

Page 17

Tray information JEDEC Tray for IT3M 100 Position Receptacles JEDEC Tray for IT3M 200 Position Receptacles JEDEC Tray for IT3M 300 Position Receptacles IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors 17 ...

Page 18

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors Tray information (con’t) JEDEC Tray for IT3D 100 Position Receptacles JEDEC Tray for IT3D 200 Position Receptacles JEDEC Tray for IT3D 300 Position Receptacles 18 ...

Page 19

NOTES : IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors 19 ...

Page 20

IT3 Series High-Speed(10 + Gbps) BGA Mezzanine Connectors USA: HIROSE ELECTRIC (U.S.A.), INC. Headquarters 2688 Westhills Court, Simi Valley, CA 93065-6235 Phone : 1-805-522-7958 Fax : 1-805-522-3217 http://www.hiroseusa.com USA: HIROSE ELECTRIC (U.S.A.), INC. Chicago Office 2777 Finley Road, Suite 19 ...

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