HDAM-23-12.0-S-13-2 Samtec Inc, HDAM-23-12.0-S-13-2 Datasheet
HDAM-23-12.0-S-13-2
Manufacturer Part Number
HDAM-23-12.0-S-13-2
Description
CONN HD ARRAY 299POS MALE GOLD
Manufacturer
Samtec Inc
Series
HD Mezz™ HDAMr
Datasheet
1.HDAM-11-12.0-S-13-2.pdf
(1 pages)
Specifications of HDAM-23-12.0-S-13-2
Connector Type
High Density Array, Male
Number Of Positions
299
Pitch
0.047" (1.20mm)
Number Of Rows
13
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
20mm, 30mm
Height Above Board
0.767" (19.48mm)
Pitch Spacing
1.2mm
No. Of Contacts
299
Gender
Header
Contact Plating
Gold
Row Pitch
2mm
No. Of Rows
13
Contact Termination
Surface Mount Vertical
Contact Material
Copper Alloy
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SAM8643
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HDAM-23-12.0-S-13-2
Manufacturer:
Samtec Inc.
Quantity:
12 000
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50µ" (1,27µm) Ni
Contact Resistance:
19 mΩ max
Working Voltage:
200 VAC
Mated Cycles:
100
RoHS Compliant:
Y es
Lead-Free Solderable:
Y es
Note: Other Gold plating
options available.
Contact Samtec.
RUGGED ELEVATED HIGH DENSITY ARRAY
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
F-211
ALSO AVAILABLE
SPECIFICATIONS
(2,00mm) .0787"
HDAM, HDAF SERIES
Tin-Lead Solder Charge.
APPLICATIONS
(2,00)
DIFFERENTIAL
.0787
*2:1 S:G Ratio
ARRAY
11x13
15x13
23x13
Call Samtec.
(1,20)
.0472
COUNT*
PAIR
44
60
92
HDAM
HDAF
(2,00)
.0787
(2,00)
.0787
1A
®
(1,20)
.0472
1A
MEZZ
–11, –15, –23
–11, –15, –23
(22,50) .886
NO. OF PINS
NO. OF PINS
(22,50)
.886
PER ROW
PER ROW
(1,20)
.0472
WWW.SAMTEC.COM
1M
HDAM–11–12.0–S–13–2
1M
(11,55)
(2,00)
.0787
Pins
Row
.455
No.
Per
of
(16,06)
x
+
No. of
(2,00)
.0787
Row
Pins
.632
Per
x
+
Specify
Specify
(11,55)
STYLE
STYLE
STYLE
STYLE
No. of
(2,00)
.0787
LEAD
LEAD
Row
LEAD
LEAD
Pins
chart
Per
.455
chart
from
from
x
+
(5,09)
.200
STYLE
–08.0
–18.0
LEAD
PLATING
PLATING
contact area,
contact area,
OPTION
OPTION
on tails and
on tails and
(10,51)
(20,51)
guide pins
weld tabs
Matte Tin
Matte Tin
(0,76µm)
(0,76µm)
.414
.807
Gold on
Gold on
A
= 30µ"
= 30µ"
A
–S
–S
(17,92)
(2,00)
.0787
Pins
Row
.706
No.
Per
of
+
x
35mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
*Data based on simulations using Final Inch
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
www.samtec.com?HDAF or contact sig@samtec.com
NO. OF
NO. OF
ROWS
ROWS
HDAF–11–08.0–S–13–2
–13
–13
STYLE
–12.0
–17.0
LEAD
A
(14,41)
(19,41)
.567
.764
3.8% Ag/0.7% Cu
A
Solder Charge
SOLDER
= Lead-Free
SOLDER
Solder Charge
95.5% Sn/
= Lead-Free
Tin Alloy
TYPE
TYPE
95.5% Sn/
Tin Alloy
3.8% Ag/
0.7% Cu
– 2
– 2
9.0 GHz / 18.0 Gbps
9.0 GHz / 18.0 Gbps
• Integrated guide
• Integrated guide
Insertion Loss*
posts
posts
Rated @ 3dB
OPTION
®
OPTION
OTHER
OTHER
Place Pad
Place Pad
= Pick &
design.
= Pick &
–P
–P
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