C0402C0G1C5R6D TDK Corporation, C0402C0G1C5R6D Datasheet - Page 59

CAP CER 5.6PF 16V C0G 01005

C0402C0G1C5R6D

Manufacturer Part Number
C0402C0G1C5R6D
Description
CAP CER 5.6PF 16V C0G 01005
Manufacturer
TDK Corporation
Series
Cr
Datasheet

Specifications of C0402C0G1C5R6D

Capacitance
5.6pF
Voltage - Rated
16V
Tolerance
±0.5pF
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Q, Low Loss
Applications
RF, Microwave, High Frequency
Package / Case
01005 (0402 Metric)
Size / Dimension
0.016" L x 0.008" W (0.40mm x 0.20mm)
Thickness
0.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-5452-2
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
c
C Series — General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
US Catalog // C Series — General Application // Version A11
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c

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