P05N-100ST-A-G 3M, P05N-100ST-A-G Datasheet - Page 4

CONN SOCKT 100POS .5MM VERT SMD

P05N-100ST-A-G

Manufacturer Part Number
P05N-100ST-A-G
Description
CONN SOCKT 100POS .5MM VERT SMD
Manufacturer
3M
Series
P05Nr
Datasheets

Specifications of P05N-100ST-A-G

Connector Type
Socket, Outer Shroud Contacts
Number Of Positions
100
Pitch
0.020" (0.50mm)
Number Of Rows
2
Mounting Type
Surface Mount
Contact Finish
Gold
Contact Finish Thickness
8µin (0.20µm)
Mated Stacking Heights
3mm
Height Above Board
0.085" (2.16mm)
Product Type
Receptacles
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
15020144802
3M9700TR
4801146301
48011463018
P05N100STAG

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P05N-100ST-A-G
Manufacturer:
3M
Quantity:
12 000
4
MetPak
MetPak
product
DIN Connectors
3M
2-FB Connectors
CP2 Connectors
Backplane connector SolutionS
• RoHS Compliant Version Available
• DIN 41612
• C-Form Plug and Socket
• C-Form Wiremount Plugs
• R-Form Plug and Socket
• Q-Form Plug and Socket
• B-Form Wiremount Plug
• Pinless Shrouds
• Solder Tails or Press-Fit
• Inverse Versions
• EMLB Contact Loading
• PCB Retention Clips
• RoHS Compliant Version Available
• Futurebus+
• Inverse Version Available
• Vertical and Right Angle
• Stacking Versions
• Elevated Versions
• Guiding Features
• Pinless Shroud
• Power Header and Socket
• RoHS Compliant Version Available
• Compact PCI
• Types A, B, AB and C
• Header and Socket
• Grounding Options
• EMLB Contact Loading
• Coding Keys
• Pinless Shroud
and Sockets
and Socket
FeatureS
®
®
Contact
Material: Copper Alloy
Insulation
Material: Engineering Thermoplastic
Flammability UL 94V-0
Plating
Underplating: 50 µ" [ 1.27 µm ]
Interface: 30 µ" [ 0.76 µm ] Gold
Contact
Material: Copper Alloy
Insulation
Material: High Temp LCP
Flammability UL 94V-0
Plating
Underplating: 50 µ" (1.27 µm) Nickel
Interface: 10 µ" [ 0.25 µm ] or 30 µ"
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: Nickel
Wiping Area: 30 µ" [ 0.76 µm ] Gold
7, 27 or 40 µ" [ 0.18, 0.69, 1.01 µm ] PdNi
Min. Nickel
or 3 µ" [ 0.08 µm ] Gold over
7 µ" [0.18 µm ] PdNi
[ 0.76 µm ] Gold or 3 to 5 µ"
[ 0.07 to 0.12 µm ] Gold over
MaterialS
3M.com/interconnects
perForMance
Current Rating: 3.0 A @ 30°C
Temperature Rating: -55°C to +125°C
Current Rating: Signal: 1.5 A
Temperature Rating: -55°C to +125°C
Current Rating: 1 A at +70°C
Temperature Rating: -55°C to +125°C
T-rise Above Ambient
All Contacts Simultaneously

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