AXN316038P Panasonic Electric Works, AXN316038P Datasheet - Page 11
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AXN316038P
Manufacturer Part Number
AXN316038P
Description
CONN SOCKET .8MM 16POS SMD
Manufacturer
Panasonic Electric Works
Series
P8r
Datasheet
1.AXN322130P.pdf
(12 pages)
Specifications of AXN316038P
Connector Type
Socket, Center Strip Contacts
Number Of Positions
16
Pitch
0.031" (0.80mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Mated Stacking Heights
3mm, 4mm, 5mm
Height Above Board
0.087" (2.20mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AXN316038P
Manufacturer:
Panasonic Electric Works
Quantity:
12 000
Company:
Part Number:
AXN316038P
Manufacturer:
NAIS
Quantity:
20 000
Regarding soldering
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) See the specifications and drawings
for the product in question for the metal
mask pattern diagrams.
4) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
5) N
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
• Narrow-pitch connector (P5 floating, P8)
ACCTB10E 201201-T
Peak temperature 260°C
(except P5 floating and P8 type)
155 to 165°C
Temperature
245°C max.
2
reflow, conducting reflow soldering
Temperature
230°C
180°C
150°C
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Preheating
60 to 120 sec.
Peak temperature
Preheating
60 to 120 sec.
NOTES FOR USING SMD TYPE CONNECTORS (Common)
Panasonic Corporation
Peak temperature
Time
200°C
Within 30 sec.
220°C
200°C
25 sec.
70 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
6) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
7) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
SMD type connectors
Terminal
Product name
Automation Controls Business Unit
Apply the solder
wire here
Pattern
Soldering iron temperature
300°C within 5 sec.
350°C within 3 sec.
PC board
Small angle as
possible up to
45 degrees
industrial.panasonic.com/ac/e
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.