NTTFS5811NLTWG ON Semiconductor, NTTFS5811NLTWG Datasheet

MOSFET N-CH 40V 53.6A 8DFN

NTTFS5811NLTWG

Manufacturer Part Number
NTTFS5811NLTWG
Description
MOSFET N-CH 40V 53.6A 8DFN
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTTFS5811NLTWG

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
6.4 mOhm @ 20A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
17A
Vgs(th) (max) @ Id
2.2V @ 250µA
Gate Charge (qg) @ Vgs
31nC @ 10V
Input Capacitance (ciss) @ Vds
1570pF @ 25V
Power - Max
2.7W
Mounting Type
Surface Mount
Package / Case
8-WDFN
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
5.5 mOhms
Forward Transconductance Gfs (max / Min)
24.6 S
Drain-source Breakdown Voltage
40 V
Continuous Drain Current
53 A
Power Dissipation
2.7 W, 33 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Gate Charge Qg
31 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTTFS5811NLTWG
Manufacturer:
ON
Quantity:
10 000
NTTFS5811NL
Power MOSFET
40 V, 53 A, 6.4 mW
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
© Semiconductor Components Industries, LLC, 2010
December, 2010 − Rev. 2
MAXIMUM RATINGS
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
Power Dissipation R
(Note 1)
Continuous Drain
Current R
Power Dissipation
R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche Energy
(L = 0.1 mH)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
Junction−to−Case – Steady
State (Note 1)
Junction−to−Ambient – Steady
State (Note 1)
Low R
Low Capacitance
Optimized Gate Charge
These Devices are Pb−Free and are RoHS Compliant
qJC
[2 oz] including traces.
(Note 1)
DS(on)
qJA
qJC
Parameter
(Note 1)
(Note 1)
Parameter
qJA
(T
t
J
Steady
p
State
= 25°C unless otherwise stated)
= 10 ms
Symbol
T
T
T
T
T
T
T
T
A
A
C
C
R
R
A
A
C
C
qJC
qJA
= 100°C
= 100°C
= 100°C
= 100°C
= 25°C
= 25°C
= 25°C
= 25°C
Symbol
V
V
E
T
I
T
I
P
P
DSS
T
I
I
DM
I
AS
stg
GS
AS
D
D
S
J
D
D
L
Value
,
3.8
47
−55 to
Value
+150
±20
260
211
2.7
1.1
40
17
10
53
33
33
13
53
65
36
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
V
V
A
A
A
A
A
†For information on tape and reel specifications,
NTTFS5811NLTAG
NTTFS5811NLTWG
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
CASE 511AB
(BR)DSS
40 V
(Note: Microdot may be in either location)
Device
WDFN8
(m8FL)
ORDERING INFORMATION
5811
A
Y
WW
G
G (4)
1
http://onsemi.com
N−Channel MOSFET
6.7 mW @ 10 V
10 mW @ 4.5 V
R
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
D (5−8)
DS(on)
(Pb−Free)
(Pb−Free)
Package
MARKING DIAGRAM
WDFN8
WDFN8
Publication Order Number:
G
S
S
S
MAX
1
S (1,2,3)
AYWWG
5811
NTTFS5811NL/D
G
Tape & Reel
Tape & Reel
Shipping
1500 /
5000 /
I
D
53 A
MAX
D
D
D
D

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NTTFS5811NLTWG Summary of contents

Page 1

... 260 °C (Note: Microdot may be in either location) L Device NTTFS5811NLTAG NTTFS5811NLTWG Value Unit 3.8 °C/W †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification 47 Brochure, BRD8011/D. 1 http://onsemi.com R MAX I MAX ...

Page 2

ELECTRICAL CHARACTERISTICS (T Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V Drain−to−Source Breakdown Voltage V Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Negative Threshold Temperature V Coefficient Drain−to−Source On Resistance Forward ...

Page 3

100 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.016 0.014 0.012 0.010 0.008 0.006 0.004 ...

Page 4

C iss 1600 1400 1200 1000 800 600 400 C oss 200 C rss DRAIN−TO−SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 0.2 10 0.1 0.05 1 0.02 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 0.1 PULSE TIME (sec) Figure 13. Thermal Response http://onsemi.com 100 1000 ...

Page 6

... M 0.57 0.75 0.47 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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