NTD6415ANLT4G ON Semiconductor, NTD6415ANLT4G Datasheet

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NTD6415ANLT4G

Manufacturer Part Number
NTD6415ANLT4G
Description
MOSFET N-CH 100V 23A 56MOHM DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD6415ANLT4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
52 mOhm @ 10A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
23A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
35nC @ 10V
Input Capacitance (ciss) @ Vds
1024pF @ 25V
Power - Max
83W
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
44 mOhms to 52 mOhms
Forward Transconductance Gfs (max / Min)
24 S
Drain-source Breakdown Voltage
92 V to 100 V
Continuous Drain Current
1 uA to 100 uA
Power Dissipation
83 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD6415ANLT4G
Manufacturer:
ON Semiconductor
Quantity:
3 800
Part Number:
NTD6415ANLT4G
Manufacturer:
ON
Quantity:
12 500
Company:
Part Number:
NTD6415ANLT4G
Quantity:
4 500
NTD6415ANL
N- -Channel Power MOSFET
100 V, 23 A, 56 mΩ, Logic
Level
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
 Semiconductor Components Industries, LLC, 2010
March, 2010 - - Rev. 0
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Drain--to--Source Voltage
Gate--to--Source Voltage -- Continuous
Continuous Drain
Current
Power Dissipation
Pulsed Drain Current
Operating and Storage Temperature Range
Source Current (Body Diode)
Single Pulse Drain--to--Source Avalanche
Energy (V
23 A, L = 0.3 mH, R
Lead Temperature for Soldering
Purposes, 1/8 from Case for 10 Seconds
Junction--to--Case (Drain) -- Steady State
Junction--to--Ambient -- Steady State (Note 1)
Compliant
Low R
100% Avalanche Tested
AEC- -Q101 Qualified
These Devices are Pb- -Free, Halogen Free/BFR Free and are RoHS
(Cu Area 1.127 sq in [2 oz] including traces).
DS(on)
DD
= 50 Vdc, V
Parameter
Parameter
G
= 25 Ω)
Steady
Steady
State
State
(T
GS
J
= 10 Vdc, I
= 25C unless otherwise noted)
t
p
= 10 ms
T
T
T
C
C
C
= 100C
= 25C
= 25C
L(pk)
=
Symbol
Symbol
T
V
R
R
J
V
E
I
P
, T
T
DSS
I
DM
I
θJC
θJA
GS
AS
D
S
D
L
stg
--55 to
Value
+175
±20
Max
100
260
1.8
23
16
83
80
23
79
39
1
C/W
Unit
Unit
mJ
C
C
W
V
V
A
A
A
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
V
(BR)DSS
100 V
ORDERING INFORMATION
6415ANL = Device Code
Y
WW
G
G
MARKING DIAGRAM
& PIN ASSIGNMENT
Gate
http://onsemi.com
56 mΩ @ 4.5 V
1
52 mΩ @ 10 V
CASE 369AA
R
1 2
DS(on)
= Year
= Work Week
= Pb--Free Package
4 Drain
STYLE 2
Drain
DPAK
D
2
3
Publication Order Number:
MAX
S
4
3
Source
NTD6415ANL/D
I
D
23 A
MAX

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NTD6415ANLT4G Summary of contents

Page 1

NTD6415ANL N- -Channel Power MOSFET 100 mΩ, Logic Level Features  Low R DS(on)  100% Avalanche Tested  AEC- -Q101 Qualified  These Devices are Pb- -Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM ...

Page 2

... Pulse Test: Pulse Width  300 ms, Duty Cycle  2%. 3. Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device NTD6415ANLT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/ 25 ...

Page 3

DRAIN--TO--SOURCE VOLTAGE (V) DS Figure 1. On- -Region Characteristics 0.050 0.048 0.046 0.044 0.042 0.040 ...

Page 4

C iss 1000 500 C rss C oss DRAIN--TO--SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 1 0.2 0.1 0.05 0.1 0.02 0.01 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 0.001 0.01 t, PULSE TIME (s) Figure 13. Thermal Response http://onsemi.com 5 0 ...

Page 6

... PL 0.13 (0.005) *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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