BL-43F0-0305 LIGHTING SCIENCE GROUP CORPORATION, BL-43F0-0305 Datasheet - Page 4

• Manufacturer Part Number: BL-43F0-0305
• Description: LED ARRAY RD/GN/BL .80 SMD
• Manufacturer: LIGHTING SCIENCE GROUP CORPORATION

Specifications of BL-43F0-0305

• Color: Red, Green, Blue (RGB)
• Current - Test: 3 x 350mA
• Luminous Flux @ Current - Test: 42lm Red, 63lm Green, 15lm Blue
• Current - Max: 400mA Blue, 400mA Green, 450mA Red
• Lumens @ Current - Max: 42lm Red, 63lm Green, 15lm Blue
• Lumens/watt @ Current - Test: 27lm/W Red, 27lm/W Green, 6lm/W Blue
• Voltage - Forward (vf) Typ: 4.5V Red, 6.7V Green, 7.6V Blue
• Wavelength: 624nm, 530nm, 425nm
• Lens Style/size: Round with Domed Top
• Viewing Angle: 120°
• Mounting Type: Surface Mount
• Package / Case: Round - 0.800" Dia x 0.160" H (20.32mm x 4.06mm)
• Illumination Color: RGB
• Power Consumption: 2.4 W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 521-1017-2

Assembly Recommendations
Lamina's BL Series Light Engines are designed for attachment to a heat sink with conductive epoxy, or screw down for flange mount
devices with thermal grease in the joint. For attachment using screws, a 2-56 UNC round head or metric equivalent M2 0.4 Cheese
Head screw, 18-8 SS is recommended. Maximum torque is 4 inch pounds (45 Newton-centimeter). Required flatness of surface light
engine is mounted to is 0.001 inch/inch.
Mechanical Specifications
Heat Sink Recommendations
Lamina LED arrays provide efficient transfer of heat from the individual LED die to a customer supplied heat sink. Lamina’s BL-4000
arrays must be operated at or below 115ºC die junction temperature. A heat sink must be attached to the array with sufficient cooling
capacity to keep the die junction below 115ºC. The temperature rise from the array base to the die junction may be determined by
calculating the product of the maximum package thermal resistance and the desired operating power level.
The appropriate heat sink may then be approximated
Lamina has developed a selection of radial heat sinks for rapid prototyping of designs with Lamina’s LED Light Engines. Lamina’s heat
sinks are available through selected distributors. More information on Lamina’s heat sinks and distributors is available on our website.
Handling Precaution
Contact with the silicone based encapsulant on the surface of the light engine must be avoided to prevent damage. Do not apply
pressure to the silicone based encapsulant or allow it to come into contact with sharp objects. Lamina LED arrays must be handled
from the sides.
about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
Ø0.750 [Ø19.05]
BOLT CIRCLE
Junction Temperature Rise (Tj (rise)) = Operating Power (P) x (Lamina Array Thermal Resistance)
Heat Sink Thermal Resistance (ºC/W) = (115 ºC - Tj (rise) - Maximum Ambient Temperature)/P
*Approximation assumes light engines are screwed down and thermal grease is used as thermal interface material.
3X 120°
Ø0.80 [Ø20.32]
0.160 [4.06] MAX
FOR 2-56 SCREW
3X MOUNTING HOLE
*
by:
Electrical Connections
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V-
BLUE
GREEN
Specifications subject to change without notice.
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©2005 Lamina Ceramics, Inc.
Westampton, NJ 08060
120 Hancock Lane
Lamina Ceramics
RED
REV. 03.11.05
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