DPAM-08-07.0-H-8-2-A Samtec Inc, DPAM-08-07.0-H-8-2-A Datasheet
DPAM-08-07.0-H-8-2-A
Manufacturer Part Number
DPAM-08-07.0-H-8-2-A
Description
CONN ARRAY DIFF MALE 8X8PAIR
Manufacturer
Samtec Inc
Series
DP Array® DPAMr
Specifications of DPAM-08-07.0-H-8-2-A
Connector Type
Differential Pair Array, Male
Number Of Positions
96 signal (48 pair)
Pitch
0.085" (2.16mm)
Number Of Rows
8
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm
Height Above Board
0.262" (6.66mm)
Pitch Spacing
2.16mm
No. Of Contacts
96
Gender
Plug
Contact Plating
Gold
Row Pitch
2.54mm
No. Of Rows
8
Contact Termination
Surface Mount Vertical
Contact Material
Copper Alloy
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SAM8040
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DPAM-08-07.0-H-8-2-A
Manufacturer:
Samtec Inc.
Quantity:
12 000
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating (2x3):
2.9A @ 30°C Temperature Rise
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4mΩ max
Working Voltage:
300 VAC
Mated Cycles:
100 Cycles
RoHS Compliant:
Y es
Lead-Free Solderable:
Yes
Note: Some sizes, styles and
options are non-standard,
non-returnable.
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
DPAF, RDPAF
DPAF Mates with:
DPAM
Note: Other Gold plating
options available.
Contact Samtec.
F-211
SPECIFICATIONS
Tin-Lead Solder Charge.
DPAM, DPAF SERIES
(2,16mm) .085"
AVAILABLE
Call Samtec.
ALSO
DPAM
DPAF
®
A
(1,27)
(6,45)
.050
(1,52)
(1,27)
.254
.050
.060
A
B
– 04, – 06, – 08,
– 08, –15, –23
02 01 G2 03 04
No. of positions x (2,16) .085 + (4,34) .171
No. of positions x (2,16) .085 + (2,95) .116
(All lead styles)
– 04, –06
–15, –23
(–07.0 only)
(1,27) .050
G1
(1,08) .0425
(2,16) .085
(1,08) .0425
PER ROW
PER ROW
(2,16) .085
No. of positions x (2,16) .085 + (2,95) .116
No. of positions x (2,16) .085 + (4,34) .171
PAIRS
PAIRS
Perimeter
Grounds (TYP)
Signal Pairs (TYP)
®
Perimeter Grounds (TYP)
Solder crimped on tail
WWW.SAMTEC.COM
(1,27)
.050
DIA
DPAF–23–03.0–H–8–2–A
Specify
STYLE
STYLE
03.0
LEAD
LEAD
chart
Gold Flash on solder tail
from
Gold on contact area,
(2,54)
(0,13)
.100
.005
=30µ" (0,76µm)
(2,54)
.100
– H
Gold on contact area,
Gold on contact area,
STYLE
NO OF
ROWS
LEAD
Tin on solder tail
–07.0
–11.0
–14.0
G1
(–11 & –14 only)
=30µ" (0,76µm)
=30µ" (0,76µm)
PLATING
OPTION
–8
–3
on solder tail
PLATING
(1,27)
OPTION
.050
Gold Flash
DIA
(–07 only)
G2
– H
– S
(10,72) .422
(13,66) .538
(24,59) .968
(11,89) .468
(6,66) .262
(0,13)
Signal
03
(TYP)
.005
Pairs
01
A
B
04
02
(2,54)
.100
Pair Rows
Pair Rows
NO. OF
ROWS
NO. OF
(–07 only)
ROWS
–08 x –8
–08 x –3
–15 x –3
–23 x –3
=Three
–15 x –8
–23 x –8
=Eight
*Assumes fi rst and last pair in
=Three
each row are grounded
=Eight
Staggered pitch DPAM/DPAF
10mm Stack Height
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
– 8
– 3
Rows
Rows
SIZE
– 8
– 3
Pair
Pair
USABLE PAIRS
PER ARRAY*
104 Pairs
168 Pairs
48 Pairs
18 Pairs
39 Pairs
63 Pairs
SOLDER
SOLDER
= Lead-Free Tin Alloy
3% Ag/.5% Cu
Solder Crimp
TYPE
TYPE
96.5% Sn/ 3%Ag/
= Lead-Free
96.5% Sn/
Tin Alloy
Solder Crimp
– 2
.5% Cu
DPAM–23–07.0–H–8–2–A
– 2
NO OF
ROWS
STYLE
*Processing conditions will
Rated @ 3dB Insertion Loss
DPAM
LEAD
–07.0
–11.0
–14.0
affect mated height.
–8
–3
7.0 GHz / 14.0 Gbps
A
A
(23,32)
(10,62)
.918
.418
MATED HEIGHT*
A
=(20,00mm) 0.80"
DIA Polyimide
=Tape & Reel
=Guide Post
(–23 only &
fi lm Pick &
Place Pad
–07 only)
– GP
–TR
DPAF
OPTION
=(20,00mm)
–03.0
10mm
14mm
17mm
OPTION
–K
Polyimide
Place Pad
0.80" DIA
–TR
& Reel
Pick &
=Tape
–K
fi lm
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